W332M64V-XSBX Datasheet, PDF (9/15 Pages) White Electronic Designs Corporation – 32Mx64 Synchronous DRAM

White Electronic Designs
W332M64V-XSBX
specified for the clock pin) prior to CKE going back
HIGH. Once CKE is HIGH, the SDRAM must have NOP
commands issued (a minimum of two clocks) for tXSR,
because time is required for the completion of any internal
refresh in progress.
Upon exiting the self refresh mode, AUTO REFRESH
commands must be issued as both SELF REFRESH and
AUTO REFRESH utilize the row refresh counter.
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on VCC, VCCQ Supply relative to Vss
Voltage on NC or I/O pins relative to Vss
Operating Temperature TA (Mil)
Operating Temperature TA (Ind)
Storage Temperature, Plastic
Unit
-1 to 4.6
V
-1 to 4.6
V
-55 to +125
°C
-40 to +85
°C
-55 to +125
°C
NOTE:
Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
CAPACITANCE (NOTE 2)
Parameter
Symbol
Max
Unit
Input Capacitance: CLK
CI1
TBD
pF
Addresses, BA0-1 Input Capacitance
CA
TBD
pF
Input Capacitance: All other input-only pins
CI2
TBD
pF
Input/Output Capacitance: I/Os
CIO
TBD
pF
BGA THERMAL RESISTANCE
Description
Junction to Ambient (No Airflow)
Junction to Ball
Junction to Case (Top)
Symbol
Max
Unit
Theta JA
20.7
C/W
Theta JB
18.1
C/W
Theta JC
7.5
C/W
Notes
1
1
1
NOTE:
Refer to Application Note “PBGA Thermal Resistance Correlation” at www.wedc.com in the application notes section for modeling conditions.
September 2005
Rev. 3
9
White Electronic Designs Corporation • [phone] • www.wedc.com