WS512K32BV-XXXE Datasheet, PDF (1/8 Pages) White Electronic Designs Corporation – 512Kx32 3.3V SRAM MODULE

White Electronic Designs
WS512K32BV-XXXE
*ADVANCED
512Kx32 3.3V SRAM MODULE
FEATURES
■ Access Times of 15*, 17, 20ns
■ 3.3V Power Supply
■ Low Voltage Operation
■ BiCMOS
■ Packaging
■ TTL Compatible Inputs and Outputs
• 66-pin, PGA Type, 1.385 inch square Hermetic
Ceramic HIP (Package 402)
■ Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
• 68 lead, Hermetic CQFP (G2), 22mm (0.880
■ Weight
inch) square (Package 500). Designed to fit
• WS512K32BV-XG2XE - 8 grams typical
JEDEC 68 lead 0.990" CQFJ footprint
• WS512K32NBV-XH2XE - 13 grams typical
■
■
■
NOT ^{RECOMENDED FOR NEW DESIGNS Organized as 512Kx32; User Configurable as}
1Mx16 or 2Mx8
Radiation Tolerant with Epitaxial Layer Die
Commercial and Industrial Temperature Ranges
* This product is under development, is not qualified or characterized and is subject to
change or cancellation without notice.
PIN CONFIGURATION FOR WS512K32NBV-XH2XE
TOP VIEW
1
12
23
I/O8
WE#2 I/O15
I/O9
CS#2 I/O14
I/O10
GND
I/O13
A13
I/O11
I/O12
A14
A10
OE#
34
45
56
I/O24
VCC
I/O31
I/O25 CS#4
I/O30
I/O26 WE#4
I/O29
A6
I/O27
I/O28
A7
A3
A0
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-18 Address Inputs
WE#1-4 Write Enables
CS#1-4 Chip Selects
OE#
Output Enable
VCC
Power Supply
GND Ground
NC
Not Connected
A15
A11
A18
NC
A4
A1
A16
A12
WE#1
A8
A5
A2
BLOCK DIAGRAM
A17
VCC
I/O7
I/O0
CS#1 I/O6
I/O1
NC
I/O5
I/O2
I/O3
I/O4
11
22
33
A9 WE#3
I/O23
I/O16 CS#3
I/O22
I/O17 GND
I/O21
I/O18
I/O19
I/O20
44
55
66
OE#
A0-18
WE#1 CS#1 WE#2 CS#2
WE#3 CS#3
WE#4 CS#4
512K x 8
512K x 8
512K x 8
512K x 8
8
8
8
8
I/O0-7
I/O8-15
I/O16-23
I/O24-31
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
December, 1999
Rev. 2
1
White Electronic Designs Corporation • [phone] • www.wedc.com