WS1M32V-XG3X Datasheet, PDF (1/6 Pages) White Electronic Designs Corporation – 1Mx32 SRAM 3.3V MODULE

White Electronic Designs
WS1M32V-XG3X
PRELIMINARY*
1Mx32 SRAM 3.3V MODULE
FEATURES
Access Times of 17, 20, 25ns
84 lead, 28mm CQFP, (Package 511)
Organized as two banks of 512Kx32, User
Configurable as 2Mx16 or 4Mx8
Commercial, Industrial and Military Temperature
Ranges
TTL Compatible Inputs and Outputs
3.3V Power Supply
Low Power CMOS
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight - WS1M32V-XG3X - 20 grams typical
*This product is under development, is not qualified or characterized and is subject to
change without notice.
PIN CONFIGURATION FOR WS1M32V-XG3X
TOP VIEW
PIN DESCRIPTION
VCC
A0
A1
A2
A3
A4
A5
A6
OE#1
OE#2
OE#3
OE#4
NC
A7
A8
A9
A10
A11
A12
A13
GND
11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75
12
74
13
73
14
72
15
71
16
70
17
69
18
68
19
67
20
66
21
65
22
64
23
63
24
62
25
61
26
60
27
59
28
58
29
57
30
56
31
55
32
54
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
GND
NC
NC
NC
NC
NC
NC
NC
NC
WE#4
WE#3
WE#2
WE#1
NC
NC
A18
A17
A16
A15
A14
VCC
I/O0-31
A0-18
WE#1-4
CS#1-2
OE#1-4
VCC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enables
+3.3V Power Supply
Ground
Not Connected
BLOCK DIAGRAM
OE#1 WE#1
OE#2 WE#2
OE#3 WE#3
OE#4 WE#4
CS#1
A0-18
5122KMxx88
5122KMxx88
5122KMxx88
512K x 8
512K x 8
512K x 8
5122MK x 8
512K x 8
8
CS#2
I/O0-7
8
I/O8-15
8
I/O16-23
Note: CS#1& CS#2 are used as bank select
8
I/O24-31
The WEDC 84 lead G3 CQFP fills the same fit and function as the JEDEC 84 lead
CQFJ or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the
CQFP form.
1.146"
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
February, 2001
Rev. 5
1
White Electronic Designs Corporation • [phone] • www.wedc.com