WS128K32XXX Datasheet, PDF (1/9 Pages) White Electronic Designs Corporation – 128Kx32 SRAM MODULE, SMD 5962-93187

White Electronic Designs
WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187
FEATURES
Access Times of 70, 85, 100, 120ns
MIL-STD-883 Compliant Devices Available
Packaging
• 66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400).
• 68 lead, 40mm Low Profile CQFP, 3.56mm
(0.140")(Package 502).
• 68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 4.57mm (0.140 inch) high,
(Package 510)
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
Commercial, Industrial and Military Temperature
Ranges
5 Volt Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS128K32-XG2UX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
Upgradeable to 512Kx32
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
Top View
1
12
23
34
45
56
I/O8
WE2#
I/O15
I/O24
VCC
I/O31
I/O9
CS2#
I/O14
I/O25
CS4#
I/O30
I/O10
GND
I/O13
I/O26
WE4#
I/O29
A14
I/O11
I/O12
A7
I/O27
I/O28
A16
A10
OE#
A12
A4
A1
A11
A9
NC
NC
A5
A2
A0
A15
WE1#
A13
A6
A3
NC
VCC
I/O7
A8
WE3#
I/O23
I/O0
CS1#
I/O6
I/O16
CS3#
I/O22
I/O1
NC
I/O5
I/O17
GND
I/O21
I/O2
I/O3
11
22
I/O4
33
I/O18
I/O19
I/O20
44
55
66
Pin Description
I/O0-31
A0-16
WE1-4#
CS1-4#
OE#
VCC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
Block Diagram
OE#
A0-16
WE1# CS1#
WE2# CS2#
WE3# CS3#
128K x 8
128K x 8
128K x 8
WE4# CS4#
128K x 8
8
I/O0-7
8
I/O8-15
8
I/O16-23
8
I/O24-31
June 2004
Rev. 4
1
White Electronic Designs Corporation • [phone] • www.wedc.com