CMA3000 Datasheet, PDF (2/18 Pages) VTI technologies – 3-axis accelerometer

CMA3000 Assembly Instructions
TABLE OF CONTENTS
1 Objective ............................................................................................................................... 3
2 VTI's 3D Stacked Wafer Level Chip-on-MEMS Package (CoM) ........................................ 3
3 CMA3000 CoM Package Outline and Dimensions ............................................................. 4
4 Packing ................................................................................................................................. 6
4.1 Tape and Reel Specifications .................................................................................................. 6
4.2 Reel packing and outer box ..................................................................................................... 8
5 Printed Wiring Board (PWB) Level Guidelines .................................................................. 9
5.1 PWB layout ................................................................................................................................ 9
5.2 Solder Paste ............................................................................................................................ 10
5.3 Stencil ...................................................................................................................................... 10
5.4 Paste Printing.......................................................................................................................... 11
5.5 Component Picking ................................................................................................................ 11
5.6 Component Placement ........................................................................................................... 11
5.7 Reflow Soldering..................................................................................................................... 11
5.8 Moisture sensitivity level (MSL) classification..................................................................... 13
5.9 Inspection ................................................................................................................................ 13
6 Rework Guidelines ............................................................................................................. 15
6.1 Preparations ............................................................................................................................ 15
6.2 Component removal ............................................................................................................... 15
6.3 PWB cleaning .......................................................................................................................... 15
6.4 Component reuse ................................................................................................................... 15
6.5 Applying flux or solder paste ................................................................................................ 15
6.6 Component placement ........................................................................................................... 16
6.7 Reflow soldering ..................................................................................................................... 16
7 Hand Soldering Guidelines ............................................................................................... 16
8 Environmental Aspects ..................................................................................................... 16
9 Effect of the Reflow Soldering .......................................................................................... 16
10 References.......................................................................................................................... 18
11 Document Revision History .............................................................................................. 18
VTI Technologies Oy
www.vti.fi
PRELIMINARY
Subject to changes
TN68
2/18
Rev.09