SCA6X0 Datasheet, PDF (1/12 Pages) VTI technologies – Assembly Instructions for SCA6x0 and SCA10x0 series

Technical Note 71
Assembly Instructions for SCA6x0 and SCA10x0 series
TABLE OF CONTENTS
Table of Contents .....................................................................................................................1
1 Objective ..............................................................................................................................2
2 VTI'S DIL-8 and DIL-12 packages.......................................................................................2
3 Package Outline and Dimensions......................................................................................2
4 Tape and reel specifications ..............................................................................................3
5 Printed Circuit Board (PCB) Level Guidelines ..................................................................5
5.1 Recommended PCB pad layout................................................................................................5
5.2 Solder paste and Cleaning process .........................................................................................5
5.3 Stencil .........................................................................................................................................6
5.4 Paste printing .............................................................................................................................6
5.5 Component picking and placement .........................................................................................6
5.6 Reflow soldering ........................................................................................................................6
5.7 Moisture sensitivity level (MSL) classification........................................................................7
5.8 Inspection ...................................................................................................................................8
6 Hand Soldering Guidelines ................................................................................................9
7 Rework Guidelines ............................................................................................................10
7.1 Instructions for desoldering and removing of component..................................................10
8 Environmental Aspects ....................................................................................................11
9 References.........................................................................................................................11
10 Document Change Control...............................................................................................12