VSC8061FI Datasheet, PDF (14/20 Pages) Vitesse Semiconductor Corporation – 2.5Gb/s 16-Bit Multiplexer/Demultiplexer Chipset

VITESSE
SEMICONDUCTOR CORPORATION
2.5Gb/s 16-Bit
Multiplexer/Demultiplexer Chipset
Data Sheet
VSC8061/VSC8062
Package Information
52-Pin Ceramic LDCC (F) Package
B
HEAT SINK SIDE
PACKAGE IS
CAVITY DOWN
52
E
45^{o 1}
N
O
KL
D
A
I
J
C
M
NOTES:
Drawing not to scale.
All units in mm unless otherwise noted.
Packages: Ceramic (alumnia)
Heat Sinks: Copper tungsten
Leads: Alloy 42 with gold plating
Item
A
B
C⁽¹⁾
D⁽¹⁾
E
mm (Min/Max)
18.54/19.56
1.02/1.52
15.49/16.51
15.24 TYP
1.27 TYP
in (Min/Max)
0.730/0.770
0.040/0.060
0.610/0.650
0.600 TYP
0.050 TYP
NOTE: (1) At package body.
Item
I
J
K⁽¹⁾
L
M
N
O
mm (Min/Max)
0.41/0.61
2.03/2.79
0.09/0.24
4.57/5.34
27.69/30.22
0.36/0.56
1.75/1.90
in (Min/Max)
0.016/0.024
0.080/0.110
0.003/0.009
0.180/0.210
1.090/1.190
0.014/0.022
0.069/0.075
Page 14
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: [phone] • Email: [e-mail]
Internet: www.vitesse.com
G52069-0, Rev 4.3
05/11/01