DG3537_11 Datasheet, PDF (9/10 Pages) Vishay Siliconix – 4ohm, 360 MHz, Dual SPST Analog Switches

DG3537, DG3538, DG3539, DG3540
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 8 BUMP (3 x 3, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)
8 x Ø 0.150  0.229
Note b
Solder Mask Ø  Pad Diameter + 0.1
0.5
0.5
Recommended Land Pattern
A
A₂
A₁
b Diameter
3
2
1
Index-Bump A1
e
Note c
XXX
3540
Top Side (Die Back)
e
S
S
e
e
D
Notes (Unless Otherwise Specified):
a. Bump is Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.
Silicon
Bump
Note a
A
B
E
C
Dim.
A
A₁
A₂
b
D
E
e
S
Min.
0.688
0.218
0.470
0.306
1.480
1.480
0.230
Notes:
a. Use millimeters as the primary measurement.
Millimeters^a
0.5 BASIC
Max.
0.753
0.258
0.495
0.346
1.520
1.520
0.270
Min.
0.0271
0.0086
0.0185
0.0120
0.0583
0.0583
0.0091
Inches
0.0197 BASIC
Max.
0.0296
0.0102
0.0195
0.0136
0.0598
0.0598
0.0106
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?73320.
Document Number: 73320
S11-0303-Rev. D, 28-Feb-11
www.vishay.com
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