DG3000_08 Datasheet, PDF (9/10 Pages) Vishay Siliconix – Low-Voltage Single SPDT MICRO FOOT®Analog Switch

PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH)
DG3000
Vishay Siliconix
6 x Ø 0.150 ∼ 0.229
Note b
Solder Mask Ø ∼ Pad Dia. + 0.1
0.5
0.5
Recommended Land Pattern
A
A₂
A₁
Index-Bump A1
Note c
XXX
3000
Top Side (Die Back)
b Diameter
e
S
3
2
S
e
D
Silicon
Bump
Note a
1
A
E
B
Notes (Unless Otherwise Specified):
a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
EUTECTIC (Sn/Pb)
Millimeters^a
Inches
Dim
Min
Max
Min
Max
A
0.615
0.715
0.0242
0.0281
A₁
0.140
0.190
0.0055
0.0075
A₂
0.470
0.495
0.0185
0.0195
b
0.180
0.250
0.0071
0.0098
D
1.555
1.585
0.0612
0.0624
E
1.055
1.085
0.0415
0.0427
e
0.5 BASIC
0.0197 BASIC
S
0.278
0.293
0.0109
0.0115
Notes:
a. Use millimeters as the primary measurement.
LEAD (Pb)-FREE (Sn/Ag/Cu)
Millimeters^a
Inches
Dim
Min
Max
Min
Max
A
0.688
0.753
0.0271
0.0296
A₁
0.218
0.258
0.0086
0.0102
A₂
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.555
1.585
0.0612
0.0624
E
1.055
1.085
0.0415
0.0427
e
0.5 BASIC
0.0197 BASIC
S
0.278
0.293
0.0109
0.0115
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Tech-
nology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?71742.
Document Number: 71742
S-70853–Rev. F, 30-Apr-07
www.vishay.com
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