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298D_08 Datasheet, PDF (9/11 Pages) Vishay Siliconix – Solid Tantalum Chip Capacitors MICROTAN™ Leadframeless Molded
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298D
Vishay Sprague
Solid Tantalum Chip Capacitors
MICROTAN™ Leadframeless Molded
POWER DISSIPATION
CASE CODE
K
298D
M
P
RECOMMENDED REFLOW PROFILES
MAXIMUM PERMISSIBLE
POWER DISSIPATION AT + 25 °C (W) IN FREE AIR
0.015
0.025
0.045
Tp °C
TL °C
Ts MAX. °C
Ts MAX. °C
Preheat (ts)
(tp)
(tL)
25 °C
All Case Codes
TYPE
TP
lead (Pb)-free
TP
Sn/Pb
tP
TL
lead (Pb)-free
TL
Sn/Pb
TS MIN. TS MIN. TS MAX. TS MAX.
tS
lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free
tS
Sn/Pb
tL
298D
260 °C
225 °C 10
217 °C
183 °C
150 °C
100 °C
200 °C
150 °C 60 - 150 60 - 90 60
PAD DIMENSIONS in inches [millimeters]
D
B
C
A
CASE CODE
298D
K
M
P
A
(MIN.)
0.028 [0.70]
0.039 [1.00]
0.063 [1.60]
B
(NOM.)
0.018 [0.45]
0.028 [0.70]
0.031 [0.80]
C
(NOM.)
0.024 [0.60]
0.24 [0.60]
0.047 [1.20]
D
(NOM.)
0.059 [1.50]
0.080 [2.00]
0.110 [2.80]
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For technical questions, contact: tantalum@vishay.com
Document Number: 40065
Revision: 01-Sep-08
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