DG3001_11 Datasheet, PDF (8/12 Pages) Vishay Siliconix – Low-Voltage Sub-ohm SPST/SPDT MICRO FOOT Analog Switch

DG3001, DG3002, DG3003
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH, 165 µm BUMP HEIGHT)
6 x Ø 0.150  0.229
Note b
Solder Mask Ø  Pad Dia. + 0.1
0.5
0.5
Recommended Land Pattern
A
A₂
A₁
Index-Bump A1
Note c
b Diameter
3
2
1
XXX
3003
Top Side (Die Back)
e
S
S
Notes (Unless Otherwise Specified):
a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
e
D
Silicon
Bump
Note a
A
E
B
EUTECTIC (Sn/Pb)
Millimeters^a
Inches
Dim.
Min.
Max.
Min.
Max.
A
0.610
0.685
0.0240
0.0270
A₁
0.140
0.190
0.0055
0.0075
A₂
0.470
0.495
0.0185
0.0195
b
0.180
0.250
0.0071
0.0098
D
1.490
1.515
0.0587
0.0596
E
0.990
1.015
0.0390
0.0400
e
0.5 BASIC
0.0197 BASIC
S
0.245
0.258
0.0096
0.0101
Notes:
a. Use millimeters as the primary measurement.
LEAD (Pb)-FREE (Sn/Ag/Cu)
Millimeters^a
Inches
Dim.
Min.
Max.
Min.
Max.
A
0.688
0.753
0.0271
0.0296
A₁
0.218
0.258
0.0086
0.0102
A₂
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.490
1.515
0.0587
0.0596
E
0.990
1.015
0.0390
0.0400
e
0.5 BASIC
0.0197 BASIC
S
0.245
0.258
0.0096
0.0102
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72505.
www.vishay.com
8
Document Number: 72505
S11-0303-Rev. D, 28-Feb-11