20CUT10 Datasheet, PDF (8/9 Pages) Vishay Siliconix – High Performance Schottky Generation 5.0, 2 x 10 A

Outline Dimensions
Vishay Semiconductors
I-PAK - S, D-PAK
DIMENSIONS FOR D-PAK in millimeters and inches
(5)
E
(3)
b3
A
0.010 M C A B
Ø2
4
L3 (3)
Ø1
B
D (5)
1
23
L4
AC
c2
A
Seating
plane
H
E1
4
D1
321
Pad layout
0.265
(6.74)
MIN.
0.488 (12.40)
0.409 (10.40)
0.245 _MIN.
(6.23)
(2) L5
b2
2x e
Detail “C”
b
0.010 M C A B
A
c
Lead tip
Detail “C”
(L1)
Rotated 90 °CW
Scale: 20:1
Gauge
C
plane
C
L2 _Ø
L
A1
(10.5.0264)MIN.
0.093 (2.38)
0.085 (2.18)
H ₍₇₎
C _Seating
plane
0.089 _MIN.
(2.28)
SYMBOL
A
A1
b
b2
b3
c
c2
D
D1
E
E1
MILLIMETERS
MIN. MAX.
2.18
2.39
-
0.13
0.64
0.89
0.76
1.14
4.95
5.46
0.46
0.61
0.46
0.89
5.97
6.22
5.21
-
6.35
6.73
4.32
-
INCHES
MIN. MAX.
0.086 0.094
-
0.005
0.025 0.035
0.030 0.045
0.195 0.215
0.018 0.024
0.018 0.035
0.235 0.245
0.205
-
0.250 0.265
0.170
-
NOTES
3
5
3
5
3
SYMBOL
e
H
L
L1
L2
L3
L4
L5
Ø
Ø1
Ø2
MILLIMETERS
MIN. MAX.
2.29 BSC
9.40 10.41
1.40
1.78
2.74 BSC
0.51 BSC
0.89
1.27
-
1.02
1.14
1.52
0°
10°
0°
15°
25°
35°
INCHES
MIN. MAX.
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF.
0.020 BSC
0.035 0.050
-
0.040
0.045 0.060
0°
10°
0°
15°
25°
35°
NOTES
3
2
Notes
(1) _{Dimensioning and tolerancing as per ASME Y14.5M-1994}
(2) _{Lead dimension uncontrolled in L5}
(3) _{Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad}
(4) _{Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip}
(5) _{Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at}
the outermost extremes of the plastic body
(6) _{Dimension b1 and c1 applied to base metal only}
(7) _{Datum A and B to be determined at datum plane H}
(8) _{Outline conforms to JEDEC outline TO-252AA}
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For technical questions within your region, please contact one of the following: Document Number: 95024
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Revision: 05-Jan-11