VS-6EWL06FN-M3 Datasheet, PDF (7/8 Pages) Vishay Siliconix – Ultralow VF Ultrafast Rectifier, 6 A FRED Pt

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Outline Dimensions
Vishay Semiconductors
D-PAK (TO-252AA) “M”
DIMENSIONS in millimeters and inches
(5)
E
(3)
b3
A
0.010 M C A B
Ø2
4
L3 (3)
Ø1
B
D (5)
1
23
L4
AC
c2 _A
Seating
plane
H
(2) L5
b2
2x e
Detail “C”
b
0.010 M C A B
A
c
Lead tip
Detail “C”
Rotated 90 °CW
Scale: 20:1
Gauge
plane
L2 _Ø
(L1)
C
C
L
E1
4
D1
321
Pad layout
0.265
(6.74)
MIN.
0.488 (12.40)
0.409 (10.40)
0.245 _MIN.
(6.23)
0.06 _MIN.
(1.524)
0.093 (2.38)
0.085 (2.18)
0.089 _MIN.
(2.28)
H ₍₇₎
C _Seating
plane
A1
SYMBOL
MILLIMETERS
MIN. MAX.
INCHES
MIN. MAX.
NOTES
SYMBOL
MILLIMETERS
MIN. MAX.
INCHES
NOTES
MIN. MAX.
A
2.18
2.39 0.086 0.094
e
2.29 BSC
0.090 BSC
A1
-
0.13
-
0.005
H
9.40 10.41 0.370 0.410
b
0.64
0.89 0.025 0.035
L
1.40
1.78 0.055 0.070
b2
0.76
1.14 0.030 0.045
L1
2.74 BSC
0.108 REF.
b3
4.95
5.46 0.195 0.215
3
L2
0.51 BSC
0.020 BSC
c
0.46
0.61 0.018 0.024
L3
0.89
1.27 0.035 0.050
3
c2
0.46
0.89 0.018 0.035
L4
-
1.02
-
0.040
D
5.97
6.22 0.235 0.245
5
L5
1.14
1.52 0.045 0.060
2
D1
5.21
-
0.205
-
3
Ø
0°
10°
0°
10°
E
6.35
6.73 0.250 0.265
5
Ø1
0°
15°
0°
15°
E1
4.32
-
0.170
-
3
Ø2
25°
35°
25°
35°
Notes
(1) _{Dimensioning and tolerancing as per ASME Y14.5M-1994}
(2) _{Lead dimension uncontrolled in L5}
(3) _{Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad}
(4) _{Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip}
(5) _{Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at}
the outermost extremes of the plastic body
(6) _{Dimension b1 and c1 applied to base metal only}
(7) _{Datum A and B to be determined at datum plane H}
(8) _{Outline conforms to JEDEC}® _{outline TO-252AA}
Revision: 24-Jun-16
1
Document Number: 95627
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