LAE1ACHIP0402KFE96 Datasheet, PDF (7/8 Pages) Vishay Siliconix – Standard Thick Film Chip Resistors

Standard Thick Film Chip Resistors
D/CRCW e3
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
4.18.2
4.35
4.24
4.25.3
4.40
4.29
4.30
4.22
4.37
4.27
Stability for product types:
D/CRCW e3
58 (Td)
Resistance to
soldering heat
Solder bath method
(260 ± 5) C;
(10 ± 1) s
-
Flamability,
needle flame test
IEC 60695-11-5;
10 s
78 (Cab)
Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
Endurance at
-
upper category
temperature
155 °C, 1000 h
-
Electrostatic
discharge
(human body model)
IEC 61340-3-1;
3 pos. + 3 neg.
discharges;
ESD voltage acc. to size
45 (XA)
Component solvent
resistance
Isopropyl alcohol;
50 °C; method 2
45 (XA)
Solvent resistance
of marking
Isopropyl alcohol;
50 °C; method 1,
toothbrush
6 (Fc)
Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz;
x, y, z  1.5 mm;
A  200 m/s²;
10 sweeps per axis
U = 15 x P₇₀ x R
-
Periodic electric
overload
 2 x U_max.;
0.1 s on; 2.5 s off;
1000 cycles
Single pulse high
Û = 10 x P₇₀ x R
-
voltage overload,
 2 x U_max.;
10 µs/700 µs
10 pulses
REQUIREMENTS
PERMISSIBLE CHANGE (R)
SIZE 0402 to 2512
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
1  to 10 M
± (0.25 % R + 0.05 )
± (0.5 % R + 0.05 )
No burning after 30 s
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (1 % R + 0.05 )
No visible damage
Marking legible,
no visible damage
± (0.25 % R + 0.05 )
± (0.5 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
All tests are carried out in accordance with the following specifications:
 EN 60115-1, generic specification
 EN 140400, sectional specification
 EN 140401-802, detail specification
 IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Document Number: 20035
For technical questions, contact: [e-mail]
www.vishay.com
Revision: 04-Jun-12
131
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