DG3003 Datasheet, PDF (7/7 Pages) Vishay Siliconix – Low-Voltage Sub-Ohm SPST/SPDT MICRO FOOT Analog Switch

New Product
DG3001/3002/3003
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (3 X 2, 0.5-mm PITCH, 165-mm BUMP HEIGHT)
6 O 0.150 X 0.180
Note 2
Solder Mask O X Pad Dia. + 0.1
0.5
0.5
Recommended Land Pattern
A
A₂
A₁
Index-Bump A1
Note 3
b Diameter
3
2
XXX
3003
Top Side (Die Back)
e
S
S
e
D
NOTES (Unless Otherwise Specified):
1. Bump is Eutectic 63/57 Sn/Pb.
2. Non-solder mask defined copper landing pad.
3. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
Silicon
Bump
Note 1
1
A
E
B
Dim
A
A₁
A₂
b
D
E
e
S
MILLIMETERS*
Min
Max
0.610
0.685
0.140
0.190
0.470
0.495
0.180
0.250
1.490
1.515
0.990
1.015
0.5 BASIC
0.245
0.258
INCHES
Min
Max
0.0240
0.0270
0.0055
0.0075
0.0185
0.0195
0.0071
0.0098
0.0587
0.0596
0.0390
0.0400
0.0197 BASIC
0.0096
0.0101
* Use millimeters as the primary measurement.
Document Number: 72505
S-32069—Rev. A, 27-Oct-03
www.vishay.com
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