CNY64AYST Datasheet, PDF (7/11 Pages) Vishay Siliconix – Optocoupler, Phototransistor Output, Very High Isolation Voltage

CNY64AYST, CNY64ABST, CNY64AGRST, CNY65AYST, CNY65ABST, CNY65AGRST
www.vishay.com
Vishay Semiconductors
SOLDERING GUIDLINES
Soldering Condition
The CNY64AxST, CNY65AxST are lead (Pb)-free devices.
They are suitable for reflow soldering. However due to large
package size, the peak package body temperature should
not go above 245 °C.
300
250 _{240 °C}
217 °C
200
245 °C
max. 20 s
150
max. 120 s
max. 100 s
100
max. ramp down 6 °C/s
50 max. ramp up 3 °C/s
0
0
22550
max. 2 cycles allowed
50 100 150 200 250 300
Time (s)
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent moisture absorption during transportation and
storage. Each bag contains a desiccant bag.
Floor Life
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 72 h
Conditions: T_amb < 30 °C, RH < 60 %
Moisture sensitivity level 4, according to J-STD-020.
Drying
In case of moisture absorption devices should be baked
before soldering according to the recommended conditions
shown below
48 h at 125 °C ± 5 °C, RH < 5%
(Not suitable for tape and reel)
In case the floor time has not exceeded 10 days the units
can be baked in tape and reel according to the following
conditions
168 h at 60 °C ± 5 °C, RH < 5 %
(Not suitable, if the floor time was exceeded by more than
10 days, or the allowed factory condition is exceeded)
PACKAGE DIMENSIONS in millimeters FOR CNY64AxxxST
14.4 ± 0.3
12.8 ± 0.2
7.2 ± 0.2
2.1 ± 0.5
Leads coplanarity
0.1 max.
Anode
Collector
Cathode
Emitter
0.5 ± 0.2
Z
5.08 ± 0.4
Z 10:1
Recommended footprint
15.9
9
6.544-5406.01-4
technical drawings
according to DIN
specifications
Rev. 1.0, 20-Sep-11
7
Document Number: 82387
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000