30CTH02SPBF_10 Datasheet, PDF (7/9 Pages) Vishay Siliconix – Hyperfast Rectifier, 2 x 15 A FRED Pt

D²PAK, TO-262
Outline Dimensions
Vishay High Power Products
DIMENSIONS FOR D²PAK in millimeters and inches
Conforms to JEDEC outline D²PAK (SMD-220)
(2)(3)
A
E
(3) L1
4
D
1 23
L2
BB
H
(2)
Detail A
2x e
2 x b2 C
2xb
0.010 M A M B
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
Lead tip
B
A
c2
(E)
A
A
c
± 0.004 M B
Gauge
plane
0° to 8°
E1
View A - A
H
L3
A1
L
L4
Detail “A”
Rotated 90 °CW
Scale: 8:1
Pad layout
11.00
(0.43)
MIN.
(D1) (3)
17.90 (0.70)
15.00 (0.625)
2.32
(0.08)
MIN.
(3)
2.64 (0.103)
2.41 (0.096)
9.65
(0.38)
MIN.
3.81
(0.15)
MIN.
Plating
(4)
b1, b3
Base
Metal
B
Seating
plane
(c)
c1 (4)
(b, b2)
Section B - B and C - C
Scale: None
SYMBOL
MILLIMETERS
MIN. MAX.
INCHES
MIN. MAX.
NOTES
A
4.06
4.83 0.160 0.190
A1
0.00 0.254 0.000 0.010
b
0.51
0.99 0.020 0.039
b1
0.51
0.89 0.020 0.035
4
b2
1.14
1.78 0.045 0.070
b3
1.14
1.73 0.045 0.068
4
c
0.38
0.74 0.015 0.029
c1
0.38
0.58
0.015 0.023
4
c2
1.14
1.65
0.045 0.065
D
8.51
9.65 0.335 0.380
2
Notes
(1) _{Dimensioning and tolerancing per ASME Y14.5 M-1994}
(2) _{Dimension D and E do not include mold flash. Mold flash shall not}
exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) _{Thermal pad contour optional within dimension E, L1, D1 and E1}
(4) _{Dimension b1 and c1 apply to base metal only}
(5) _{Datum A and B to be determined at datum plane H}
(6) _{Controlling dimension: inch}
SYMBOL
D1
E
E1
e
H
L
L1
L2
L3
L4
MILLIMETERS
MIN. MAX.
6.86
8.00
9.65 10.67
7.90
8.80
2.54 BSC
14.61 15.88
1.78
2.79
-
1.65
1.27
1.78
0.25 BSC
4.78
5.28
INCHES
MIN. MAX.
0.270 0.315
0.380 0.420
0.311 0.346
0.100 BSC
0.575 0.625
0.070 0.110
-
0.066
0.050 0.070
0.010 BSC
0.188 0.208
NOTES
3
2, 3
3
3
(7) _{Outline conforms to JEDEC outline TO-263AB}
Document Number: 95014
Revision: 31-Mar-09
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