DG3535 Datasheet, PDF (6/6 Pages) Vishay Siliconix – 0.25-OHM Low-Voltage Dual SPDT Analog Switch

DG3535/DG3536
Vishay Siliconix
New Product
PACKAGE OUTLINE
MICRO FOOT: 10-BUMP (4 X 3, 0.5-mm PITCH, 0.238-mm BUMP HEIGHT)
0.5
0.5
Recommended Land Pattern
Index-Bump A1
Note 3
XXX
3535
Top Side (Die Back)
10 O 0.150 X 0.229
Note 2
Solder Mask O X Pad Diameter +0.1
A
A₂
A₁
b Diameter
e
e
S
4
3
2
1
S
e
e
e
D
Silicon
Bump
Note 1
A
B
E
C
NOTES (Unless Otherwise Specified):
1. Bump is Lead Free Sn/Ag/Cu.
2. Non-solder mask defined copper landing pad.
3. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking;
sample only.
Dim
A
A₁
A₂
b
D
E
e
S
MILLIMETERS*
Min
Max
0.688
0.753
0.218
0.258
0.470
0.495
0.306
0.346
1.980
2.020
1.480
1.520
0.5 BASIC
0.230
0.270
INCHES
Min
Max
0.0271
0.0296
0.0086
0.0102
0.0185
0.0195
0.0120
0.0136
0.0780
0.0795
0.0583
0.0598
0.0197 BASIC
0.0091
0.0106
* Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and
Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see
http://www.vishay.com/ppg?72961.
www.vishay.com
6
Document Number: 72961
S-50130—Rev. D, 24-Jan-05