CRCW12065K11FKEA Datasheet, PDF (6/8 Pages) Vishay Siliconix – Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors

Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
D/CRCW
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60082-2
TEST
METHOD
TEST
4.5
-
4.7
-
Resistance
Voltage proof
4.13
-
Short time overload
4.17.2
58 (Td)
Solderability
4.8.4.2
4.32
-
21 (Uu₃₎
Temperature coefficient
Shear (adhesion)
PROCEDURE
Stability for product types:
D/CRCW
-
U = 1.4 · U_ins; 60 s
U = 2.5 x P₇₀ x R ≤ 2 x U_max.;
duration: Acc. to style
Solder bath method; Sn60Pb40;
non-activated flux;
(235 ± 5) °C, (2 ± 0.2) s
(20/- 55/20) °C and
(20/125/20) °C
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
4.18.2
4.35
4.24
4.25.3
4.40
4.29
4.30
21 (Uu₁₎
Substrate bending
14 (Na) Rapid change of temperature
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
-
Endurance at 70 °C
58 (Td) Resistance to soldering heat
-
Flamability, needle flame test
78 (Cab)
-
-
Damp heat, steady state
Endurance at upper
category temperature
Electrostatic discharge
(human body model)
45 (XA) Component solvent resistance
45 (XA) Solvent resistance of marking
Depth 2 mm; 3 times
30 min. at - 55 °C;
30 min. at 125°C
5 cycles
1000 cycles
-
125 °C; 16 h
55 °C; ≥ 90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C; ≥ 90 % RH;
24 h; 5 cycles
U = P₇₀ x R
U = √(P₇₀ x R) ≤ U_max.
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
Solder bath method
(260 ± 5) °C; (10 ± 1) s
IEC 60695-11-5;
10 s
(40 ± 2) °C;
(93 ± 3) % RH; 56 days
155 °C; 1000 h
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD test voltage acc. to size
Isopropyl alcohol;
50 °C; method 2
Isopropyl alcohol;
50 °C; method 1, toothbrush
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
STABILITY CLASS 1 STABILITY CLASS 2
OR BETTER
OR BETTER
1 Ω to 10 MΩ
1 Ω to 10 MΩ
±1%
±5%
No flashover or breakdown
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
Good tinning (≥ 95 %
covered);
no visible damage
± 100 ppm/K
± 200 ppm/K
No visible damage
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (0.25 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
± (0.5 % R + 0.05 Ω)
No burning after 30 s
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (1 % R + 0.05 Ω)
No visible damage
Marking legible,
no visible damage
Document Number: 20008
Revision: 18-Nov-10
For technical questions, contact: [e-mail]
www.vishay.com
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