23816153202 Datasheet, PDF (6/7 Pages) Vishay Siliconix – SMD 0603, Glass Protected NTC thermistors

2381 615 3..../NTCS0603E3.....T
Vishay BCcomponents
SMD 0603, Glass Protected
NTC Thermistors
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with “CECC 00802”. The maximum temperature
of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
300
260 °C
250
≈ 245 °C
200 ^{215 °C}
180 °C
150
130 °C
100
50
Reflow Soldering
2 K/s
10 s
10 s
40 s
0
0
50
100
150
200
250
Time (s)
Lead (Pb)-free Reflow Soldering Profile
300
260 °C
250 ^{≈ 245 °C}
235 °C
200
≈ 170 °C
150
≈ 120 °C
100
2 K/s
50
max.
0
0
50 100 150 200
40 s max.
20 s min.
≈ 60 s
6 K/s
max.
limit
normal
250 300 350
Time (s)
Dimensions of the solder lands
0.8
1.0
2.4
TESTS AND REQUIREMENTS
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
TEST METHOD
TEST
PROCEDURE
Solderability
2 s at 235 °C
6
T_C
Resistance to soldering heat
10 s at 260 °C
REQUIREMENTS
Min. 95 % of surface wetted
ΔR/R < 5 %
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with “IEC 60286-3”. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
P0
D0
P2
B0
A0
P1
www.vishay.com
32
T
E1
F
W
T1
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A₀ ⁽¹⁾
B₀ ⁽¹⁾
W
DIMENSION
1.15
1.9
8.0
TOLERANCE
± 0.1
± 0.1
± 0.2
E₁
1.75
± 0.1
F
3.5
± 0.05
D₀
P₀ ⁽²⁾
P₁
P₂
T tape thickness
1.55
4.0
4.0
2.0
1.1
± 0.05
± 0.1
± 0.1
± 0.05
max.
T₁ cover tape
< 0.1
-
Notes
(1) _{Measured 0.3 mm above base pocket}
(2) _{P0 pitch cumulative error over any 10 pitches ± 0.2 mm}
For technical questions, contact: [e-mail]
Document Number: 29056
Revision: 22-Apr-09