TCPT1200_07 Datasheet, PDF (5/9 Pages) Vishay Siliconix – Subminiature Transmissive Optical Sensor with Phototransistor Output, RoHS Compliant, Released for Lead (Pb)-free Solder Process

Reflow Solder Profiles
280
260
260 °C
240
230 °C
220
200
4 °C/s MAX
180
4 °C/s MAX
160
140
180 °C
150 °C
Heating time:
30 ± 10 s
120
Pre-heating time:
100
90 ± 30 s
80
19152
Time (s)
Figure 13. Lead (Pb)-free (Sn) Reflow Solder Profile
280
260
240
240 °C
230 °C
220
200
4 °C/s MAX
180 _{4 °C/s MAX}
160
140
180 °C
150 °C
Heating time:
10 - 20 s
120
Pre-heating time:
100
90 ± 30 s
80
19153
Time (s)
Figure 14. Lead Tin (SnPb) Reflow Solder Profile
TCPT1200
Vishay Semiconductors
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from absorbing moisture during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. According JEDEC, J-STD-020, this com-
ponent is released to Moisture Sensitivity Level 2, for
use of Lead Tin (SnPb) Reflow Solder Profile
(Figure 14) or Level 3, for use of Lead (Pb)-free (Sn)
Reflow Solder Profile (Figure 13).
Floor Life: 12 month (Level 2) or 168 hours (Level 3)
Floor Conditions: T_amb < 30 °C, RH < 60 %
Drying
In case of moisture absorption, devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (± 5 °C), RH < 5 % or 96 h
at 60 °C (± 5 °C), RH < 5 %.
Document Number 83753
Rev. 1.9, 13-Mar-07
www.vishay.com
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