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SIP41104 Datasheet, PDF (5/8 Pages) Vishay Siliconix – Half-Bridge N-Channel MOSFET Driver for DC/DC Conversion
FUNCTIONAL BLOCK DIAGRAM
VDD
UVLO
OTP
PWM
GND
TRI STATE
DETECT
SiP41104
Vishay Siliconix
-
+
VBBM
VDD
BOOT
OUTH
LX
OUTL
Figure 1.
DETAILED OPERATION
PWM
The PWM pin controls the switching of the external
MOSFETs. The driver logic operates in a noninverting
configuration. The PWM input stage should be driven by a
signal with fast transition times, like those provided by a
PWM controller or logic gate, (< 200 ns). The PWM input
functions as a logic input and is not intended for applications
where a slow changing input voltage is used to generate a
switching output when the input switching threshold voltage
is reached.
Low-Side Driver
The supplies for the low-side driver are VDD and GND.
During shutdown, OUTL is held low.
High-Side Driver
The high-side driver is isolated from the substrate to create a
floating high-side driver so that an N-Channel MOSFET can
be used for the high-side switch. The supplies for the high-
side driver are BOOT and LX. The voltage is supplied by a
floating bootstrap capacitor, which is continually recharged
by the switching action of the output. During shutdown OUTH
is held low.
Bootstrap Circuit
The internal bootstrap diode and a bootstrap capacitor form
a charge pump that supplies voltage to the BOOT pin. An
integrated bootstrap diode replaces the external Schottky
diode needed for the bootstrap circuit; only a capacitor is
necessary to complete the bootstrap circuit. The bootstrap
capacitor is sized according to,
CBOOT = (QGATE/ΔVBOOT - LX) x 10
where QGATE is the gate charge needed to turn on the high-
side MOSFET and ΔVBOOT - LX is the amount of droop
allowed in the bootstrapped supply voltage when the high-
side MOSFET is driven high. The bootstrap capacitor value
is typically 0.1 µF to 1µF. The bootstrap capacitor voltage
rating must be greater than VDD + 5 V to withstand transient
spikes and ringing.
Shoot-Through Protection
The external MOSFETs are prevented from conducting at
the same time during transitions. Break-before-make circuits
monitor the voltages on the LX pin and the OUTL pin and
control the switching as follows: When the signal on PWM
goes low, OUTH will go low after an internal propagation
delay. After the voltage on LX falls below 1 V by the inductor
action, the low-side driver is enabled and OUTL goes high
after some delay. When the signal on PWM goes high, OUTL
will go low after an internal propagation delay. After the
voltage on OUTL drops below 1 V the high-side driver is
enabled and OUTH will go high after an internal propagation
delay. If LX does not drop below 1 V within 400 ns after
OUTH goes low, OUTL is forced high until the next PWM
transition.
Document Number: 72706
S09-1454-Rev. E, 03-Aug-09
www.vishay.com
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