CRCW0603820RFKEAHP Datasheet, PDF (5/6 Pages) Vishay Siliconix – Pulse Proof, High Power Thick Film Chip Resistors

CRCW....-HP e3
Vishay
Pulse Proof, High Power Thick Film Chip Resistors
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
TEST
(clause)
CONDITIONS OF TEST
Resistance (4.5)
Temperature coefficient (4.8.4.2)
Overload (4.13)
Solderability (4.17.5)
Resistance to soldering heat (4.18.2)
Rapid change of temperature (4.19)
Damp heat, steady state (4.24)
Climatic sequence (4.23)
Endurance at 70 °C (4.25.1)
Endurance at upper category temperature
(4.25.3)
Stability for product types:
CRCW....-HP e3
-
20/- 55/20 °C and
20/125/20 °C
U = 2.5 x P₇₀ x R
≤ 2 × U_max.;
Duration: according the style
Aging 4 h at 155 °C, dryheat
Solder bath method; 235 °C; 2 s
Visual examination
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
30 min at LCT = - 55 °C;
30 min at UCT = 125 °C; 5 cycles
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
16 h at UCT = 125 °C; 1 cycle at 55 °C;
2 h at LCT = - 55 °C;
1 h/1 kPa at 15 °C to 35 °C;
5 cycles at 55 °C
U = P₇₀ x R
U = U_max.; whichever is less severe
U = P₇₀ x R
U = U_max.; whichever is less severe
1.5 h ON; 0.5 h OFF;
70 °C; 1000 h
UCT = 155 °C; 1000 h
REQUIREMENTS
PERMISSIBLE CHANGE
(ΔR)
STABILITY CLASS 2
OR BETTER
1 Ω - 1 MΩ
± 1 %, ± 5 %
± 100 ppm/K, ± 200 ppm/K
± (0.5 % R + 0.05 Ω)
Good tinning (≥ 95 % covered)
no visible damage
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.05 Ω)
± (2 % R + 0.05 Ω)
± (2 % R + 0.05 Ω)
± (2 % R + 0.05 Ω)
APPLICABLE SPECIFICATIONS
• EN 60115-1
• AEC-Q200
• EN 140400
• EN 140401-802
• IEC 60068-2-X
• IEC 60286-3
Generic specification
Generic specification
Sectional specification
Detail specification
Variety of environmental test procedures
Packaging of SMD components
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Document Number: 20043
Revision: 07-May-09