BU2506-E3 Datasheet, PDF (5/6 Pages) Vishay Siliconix – Thin single in-line package

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BU2506-E3, BU2508-E3, BU2510-E3
Vishay General Semiconductor
FORMING SPECIFICATION: BU-5S in inches (millimeters)
0.125 (3.2) x 45°
Chamfer
0.880 (22.3)
0.860 (21.8)
0.160 (4.1)
0.140 (3.5)
0.020R (TYP.)
0.310 (7.9)
0.290 (7.4)
0.080 (2.03)
0.060 (1.52)
0.075
(1.9) R
0.085 (2.16)
+ ~~ _-
0.065 (1.65)
0.100 (2.54)
0.085 (2.16)
0.050 (1.27)
0.040 (1.02)
0.213 (5.40)
0.173 (4.40)
0.417 (10.60)
0.370 (9.40)
0.080 (2.03)
0.065 (1.65)
0.319 (8.10)
0.272 (6.90)
0.319 (8.10)
0.272 (6.90)
0.161 (4.10)
0.142 (3.60)
9°
TYP.
0.219 (5.55)
MAX.
0.134 (3.40)
0.087 (2.20)
0.740 (18.8)
0.720 (18.3)
5°
TYP.
0.315 (8.0)
0.276 (7.0)
0.028 (0.72)
0.020 (0.52)
APPLICATION NOTE
(1) Device UL approved for safety use dielectric strength of 1500 V.
(2) If device is mounted in Floating Ground (F. G.) application, insulator is recommended to use to meet safety requirement.
(3) Heat sink shape recommendation:
(3)
Heatsink
2.5 mm MIN.
By Safety Requirements
2.5 mm MIN.
Revision: 16-Aug-13
5
Document Number: 84805
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