ACAC0612_08 Datasheet, PDF (5/6 Pages) Vishay Siliconix – Precision Thin Film Chip Resistor Array

ACAC 0612, ACAS 0612 - Precision
Vishay Beyschlag
Precision Thin Film Chip Resistor Array
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
following specifications:
EN 60115-1, Generic specification (includes tests)
EN 140400, Sectional specification (includes schedule for
qualification approval)
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202.
The tests are carried out in accordance with IEC 60068*
and under standard atmospheric conditions according to
IEC 60068-1*, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower Category Temperature, Upper
Category Temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
In the following table only the tests and requirements are
listed with reference to the relevant clauses of EN 60115-1
and IEC 60068-2*; a short description of the test procedure
is also given.
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2*
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS ⁽¹⁾
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
ACAC 0612, ACAS 0612
47 Ω to 221 kΩ
4.5
4.8.4.2
-
Resistance
-
Temperature coefficient
Climatic category
(LCT/UCT/duration)
-
At 20/LCT/ 20 °C and
20/UCT/20 °C
- 55 °C/+ 125 °C/56 days
± 0.5 %; ± 0.25 %
± 50 ppm/K; ± 25 ppm/K
4.25.1
-
Endurance
U = P₇₀ x R or U = U_max.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (0.25 % R + 0.05 Ω)
4.25.3
4.24
-
78 (Cab)
Endurance at upper
category temperature
Damp heat,
steady state
125 °C; 1000 h
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
± (0.25 % R + 0.05 Ω)
± (0.25 % R + 0.05 Ω)
4.13
4.19
4.18.2
-
14 (Na)
Short time overload ⁽²⁾
Rapid change of
temperature
58 (Td)
Resistance to soldering
heat
U = 2.5 x P₇₀ x R or
U = 2 x U_max.; 5 s
30 min at LCT and
30 min at UCT;
5 cycles
Reflow method 2
(IR/forced gas convention);
(260 ± 5) °C;
(10 ± 1) s
± (0.1 % R + 0.01 Ω)
no visible damage
± (0.1 % R + 0.01 Ω)
no visible damage
± (0.1 % R + 0.01 Ω)
no visible damage
4.17.2
4.32
4.33
58 (Td)
21 (Ue₃)
21 (Ue₁)
Solderability
Shear (adhesion)
Substrate bending
Solder bath method;
SnPb; non-activated flux
accelerated ageing 4 h/155 °C
(215 ± 3) °C; (3 ± 0.3) s
Solder bath method;
SnAgCu; non-activated flux
accelerated ageing 4 h/155 °C
(235 ± 3) °C; (2 ± 0.2) s
45 N
Depth 2 mm, 3 times
Good tinning (≥ 95 % covered);
no visible damage
No visible damage
± (0.1 % R + 0.01 Ω)
no visible damage;
no open circuit in bent position
U_rms = U_ins
4.7
-
Voltage proof
60 ± 5 s; against ambient,
between adjacent resistors
No flashover or breakdown
Notes
(1) _{Figures are given for equal values}
(2) _{For a single element}
• The quoted IEC standards marked with an asterisk (*) are also released as EN standards with the same number and identical contents
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Document Number: 28751
Revision: 11-Sep-08