Y402412K7560T9R Datasheet, PDF (4/7 Pages) Vishay Siliconix – Z-1 Foil Ultra High Precision Wrap-around Chip Resistor

FRSM Series of Precision Chip Resistors
Vishay Foil Resistors
FIGURE 4 - RECOMMENDED MOUNTING
Notes
(1) _{IR and vapor phase reflow are recommended.}
(2) _{Avoid the use of cleaning agents which could attack epoxy resins, which form part}
of the resistor construction
(3) _{Vacuum pick up is recommended for handling}
(4) _{Soldering iron may damage the resistor}
PULSE TEST
TEST DESCRIPTION
All parts baked at +125°C for 1 hr and allowed to cool at room
temperature for 1 hr, prior to testing. By using an electrolytic 0.01µF
capacitor charged to 1000 VDC, a single pulse was performed on 20
units of 1206, for each value: 100Ω, 1KΩ and 10KΩ of Surface
Mount Vishay Foil resistor and Thin Film resistor. The unit was
allowed time to cool down, after which the resistance measurement
was taken and displayed in ppm deviation from the initial reading.
TEST RESULTS
FIGURE 5 - PULSE TEST DESCRIPTION
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TABLE 5 - PULSE TEST RESULTS
VALUE VOLTAGE
100R
1K
10K
1000VDC
T= RC
1µsec
10 µsec
100 µsec
AVERAGE DEVIATION
(%)
VISHAY
FOIL
RESISTOR
THIN
FILM
Open
<0.001
>35
>0.008
FIGURE 6 - THERMAL SHOCK TEST
Test per MIL PRF 55342 4.8.3 Mil STD 202, Method 107
Test Conditions: 100 X (-65°C to +150°C), n=10
100
80
60
40
20
0
-20
0805
1K
0805
8K
1206
1K
1206
25K
2512
1K
2512
75K
ELECTROSTATIC DISCHARGE (ESD)
ESD can be categorized into three types of damages
Parametric Failure - occurs when the ESD event alters one or more
device parameters (resistance in the case of resistors), causing it to
shift from its required tolerance. This failure does not directly pertain
to functionality; thus a parametric failure may be present while the
device is still functional.
Catastrophic Damage - occurs when the ESD event causes the
device to immediately stop functioning. This may occur after one or
a number of ESD events with diverse causes, such as human body
discharge or the mere presence of an electrostatic field.
Latent Damage - occurs when the ESD event causes moderate
damage to the device, which is not noticeable, as the device appears
to be functioning correctly. However, the load life of the device has
been dramatically reduced, and further degradation caused by
operating stresses may cause the device to fail during service.
Latent damage is the source for greatest concern, since it is very
difficult to detect by re-measurement or by visual inspection, since
damage may have occurred under the external coating.
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Document Number: 63209
Revision: 7-Apr-11