VEMT3700_10 Datasheet, PDF (4/6 Pages) Vishay Siliconix – Silicon NPN Phototransistor

VEMT3700
Vishay Semiconductors
Silicon NPN Phototransistor
PACKAGE DIMENSIONS in millimeters
Mounting Pad Layout
1.2
area covered with
solder resist
4
1.6 (1.9)
20873
SOLDER PROFILE
300
250
255 °C
240 °C
217 °C
200
150
max. 120 s
100
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. ramp up 3 °C/s max. ramp down 6 °C/s
0
0
50 100 150 200 250 300
19841
Time (s)
Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T_amb < 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
www.vishay.com
4
For technical questions, contact: [e-mail]
Document Number: 81478
Rev. 1.6, 14-Jul-10