VEMD2000X01_11 Datasheet, PDF (4/8 Pages) Vishay Siliconix – Silicon PIN Photodiode

www.vishay.com
REFLOW SOLDER PROFILE
300
250
255 °C
240 °C
217 °C
200
150
max. 120 s
100
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. ramp up 3 °C/s max. ramp down 6 °C/s
0
0
19841
50 100 150 200 250 300
Time (s)
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
VEMD2000X01, VEMD2020X01
Vishay Semiconductors
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: T_amb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
PACKAGE DIMENSIONS in millimeters: VEMD2000
0.4
Ø 1.8 ± 0.1
Z
2.2
5.8 ± 0.2
2.3 ± 0.2
2.2
Z 20:1
exposed copper
1.1 ± 0.1
Cathode
1.7
Pin ID
Anode
Solder pad proposal
acc. IPC 7351
6.7
Drawing-No.: 6.544-5391.02-4
Issue: 2; 18.03.10
21517
Ø 2.3 ± 0.1
technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.1
Rev. 1.3, 23-Aug-11
4
Document Number: 81962
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000