SM-4 Datasheet, PDF (4/7 Pages) Vishay Siliconix – Surface Mount Cermet Trimmers (12 Turns)

Surface Mount Cermet Trimmers (12 Turns)
SM-4
Vishay
MECHANICAL SPECIFICATIONS
Mechanical turn
Operating torque
Mechanical stop
Rotational life
Thrust to shaft
Solderability
Shear (Adhesion)
Substratre bending
Pull-off strength
12 turns
20 mN m {204 gf cm} maximum
Clutch action
200 cycles [Δ R/R ≤ ± (3 Ω + 3 %)]
5 N {0.51 kgf} minimum
Sn-Pb: 235 °C, 2 s
Sn-Cu (Lead (Pb)-free): 245 ± 3 °C,
2∼3s
5 N {0.51 kgf} 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf} 10 s
ELECTRICAL CHARACTERISTICS
Nominal resistance range
10 Ω ∼ 2 MΩ
Resistance tolerance
± 10 %
Power ratings
0.25 W (85 °C) 0 W (150 °C)
Resistance law
Linear law (B)
Maximum input voltage
DC300 V or power rating,
whichever is smaller
Maximum wiper current
100 mA or power rating,
whichever is smaller
Effective electrical turn
10 turns
End resistance
C.R.V.
1 % or 2 Ω, whichever is greater
1 % or 3 Ω, whichever is greater
Operating temp. range
Temp. coefficient
Insulation resistance
- 6 ∼ 150 °C
± 100 10^-6 /°C maximum
1000 MΩ minimum (DC500 V)
Dielectric strength
AC600 V, 60 s
Net weight
Approx. 0.2 g
Reflow profile for soldering heat evaluation
(°C)
250
200
180 °C
150 150°C
100
50
Peak : 250⁺⁰⁵°C
Over 230 °C
Pre Heating Zone
90 ± 30 s
30 ± 10 s
Heating time ^{Soldering Zone}
Reflow : two times maximum
ENVIRONMENTAL SPECIFICATIONS
Test item
Thermal shock
Humidity
Shock
Test conditions
- 65 ∼ 150 °C
(0.5 h), 5 cycles
- 10 ∼ 65 °C
(Relative humidity
80 ∼ 98 %),
10 cycles, 240 h
981 m/s², 6 ms
6 directions for 3
times each
Specifications
[ΔR/R ≤ 2 %]
[S.S. ≤ 1 %]
[ΔR/R ≤ 2 %]
Vibration
Load Life
Low temperature
operation
High temperature
exposure
Immersion seal
Amplitude 1.52 mm
or
Acceleration
196 m/s^2,
10 ∼ 2000Hz,
3 directions, 12
times each
85 °C, 0.25 W, 1000
h
- 65 °C, 2 h
150 °C, 250 h
85 °C, 60 s
Sn-Pb
260 °C, 10 s or
215 °C, 35 s
[ΔR/R ≤ 1 %]
[S.S. ≤ 1 %]
[ΔR/R ≤ 2 %]
[S.S. ≤ 1 %]
[ΔR/R ≤ 1 %]
[S.S. ≤ 1 %]
[ΔR/R ≤ 2 %]
[S.S. ≤ 1 %]
No leaks (No
continuous bubbles)
Soldering heat
Sn-Cu
Flow: 260 °C ± 3 °C
as the temperature
in a pot of molten
solder, immersion
from head of
terminal to backside
of board, 5 ∼ 6 s,
two times maximum
Reflow: Peak
temperature 255 °C
(Please refer to the
profile below.)
Manual soldering:
350 ± 10 °C, 3 ∼ 4 s
[ΔR/R ≤ 1 %]
Document Number: 58008
Revision: 06-Mar-06
For technical questions contact: [e-mail]
www.vishay.com
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