Z300_15 Datasheet, PDF (3/5 Pages) Vishay Siliconix – Axial Cemented Wirewound Resistors

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DIMENSIONS
G
B
A
Z300
Vishay Draloric
C
For packaging dimensions see appropriate catalog or web page.
MODEL
Z301
A_MAX.
8.5 [0.355]
ZDA0411
11 [0.433]
Z302
13 [0.512]
Z303
15.8 [0.622]
Z305
22.3 [0.878]
Z306
32.3 [1.272]
Z307
49.8 [1.961
Note
(1) _{C according to IEC 60301.}
B_MAX.
3 [0.118]
4 [0.157]
4.8 [0.189]
5.5 [0.217]
8.7 [0.343]
8.7 [0.343]
9 [0.354]
DIMENSIONS in millimeters [inches]
C ⁽¹⁾
G
0.7 [0.027]
53 ± 1 [2.087 ± 0.039]
0.7 [0.027]
53 ± 1 [2.087 ± 0.039
0.8 [0.031]
53 ± 1 [2.087 ± 0.039]
0.8 [0.031]
53 ± 1 [2.087 ± 0.039]
0.8 [0.031]
83 ± 1 [3.268 ± 0.039]
0.8 [0.031]
83 ± 1 [3.268 ± 0.039]
0.8 [0.031]
120 ± 2 [4.724 ± 0.079]
DIMENSIONS ZDV0411
P₂
P
H₁
d
H_{0 H}
L
Δh₁
Ø 4 max.
“Z”
1 max.
W₂
W_{0 W1}
W
P₁
F
D₀
P₀
t
R ^a1
a₂
d₁/d₂ = 35 ... 45°
R ^a1^/a2 ^{= < 1.25}
d₁ d₂
RR
Notes
(2) _{Test over 10 holes - 9 intervals P0 12 x 9 = 114.3 ± 0.5}
(3) _{Parallelism, < 0.5 mm}
(4) _{Thickness of carrier tape: 0.55 mm ± 0.1}
DIMENSIONS in millimeters
Lead Ø
d
Pitch of components
P
Pitch of sprocket holes ⁽²⁾
P₀
Distance between hole
center and resistor center
P₁
Distance between hole
center and lead center
P₂
Lead spacing
F
Angle of Insertion
h₁
Width of carrier tape
W
Width of adhesive tape
W₀
Position of holes
W₁
Position of adhesive tape
W₂
Body to hole center
H
Lead crimp to hole
center ⁽³⁾
H₀
Hole Ø
D₀
Thickness of tape ⁽⁴⁾
t
Height of cutting
L
Height of insertion
H₁
MASS (g)
0.5
0.8
1.1
1.4
3.7
5
7
TOL.
0.6
12.7
± 1.0
12.7
± 0.3
3.85
± 0.7
6.35
± 0.7
5
2 max.
18.0
12.0
9
0.5
16.0
+ 0.6, - 0.1
-
+ 1, - 0.5
± 0.5
+ 0.75, - 0.5
+ 0, - 0.5
± 0.5
19.5
± 1.0
4.0
0.9 max.
11 max.
32.3 max.
± 0.2
-
-
-
Revision: 24-Feb-14
3
Document Number: 21007
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000