VS-VSKD56 Datasheet, PDF (3/9 Pages) Vishay Siliconix – Industrial standard package

VS-VSKD56.., VS-VSKE56.., VS-VSKJ56.., VS-VSKC56..
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Vishay Semiconductors
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Junction and storage temperature range
Maximum internal thermal resistance,
junction to case per leg
Typical thermal resistance,
case to heat sink per module
T_J, T_Stg
R_thJC
R_thCS
DC operation
Mounting surface flat, smooth and greased
Mounting torque ± 10 %
to heatsink
busbar
A mounting compound is recommended and the
torque should be rechecked after a period of
3 hours to allow for the spread of the compound.
Approximate weight
Case style
JEDEC^®
VALUES
-40 to +150
0.33
0.1
UNITS
°C
°C/W
4
Nm
3
75
g
2.7
oz.
ADD-A-PAK Gen 7 (TO-240AA)
R CONDUCTION PER JUNCTION
DEVICES
SINE HALF WAVE CONDUCTION
180°
120°
90°
60°
30°
VSK.56
0.115 0.136 0.173 0.236 0.346
RECTANGULAR WAVE CONDUCTION
180°
120°
90°
60°
30°
0.09
0.145
0.185
0.243
0.349
Note
• Table shows the increment of thermal resistance R_thJC when devices operate at different conduction angles than DC
UNITS
°C/W
Revision: 05-Apr-16
3
Document Number: 94625
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