VS-ST300C Datasheet, PDF (3/8 Pages) Vishay Siliconix – Metal case with ceramic insulator

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TRIGGERING
PARAMETER
Maximum peak gate power
Maximum average gate power
Maximum peak positive gate current
Maximum peak positive gate voltage
Maximum peak negative gate voltage
DC gate current required to trigger
DC gate voltage required to trigger
DC gate current not to trigger
DC gate voltage not to trigger
VS-ST300C Series
Vishay Semiconductors
SYMBOL
TEST CONDITIONS
VALUES
UNITS
TYP. MAX.
P_GM
P_G(AV)
T_J = T_J maximum, t_p  5 ms
T_J = T_J maximum, f = 50 Hz, d% = 50
10.0
W
2.0
I_GM
T_J = T_J maximum, t_p  5 ms
3.0
A
+ V_GM
- V_GM
T_J = T_J maximum, t_p  5 ms
20
V
5.0
T_J = - 40 °C
200 -
I_GT
T_J = 25 °C
T_J = 125 °C
T_J = - 40 °C
V_GT
T_J = 25 °C
Maximum required gate trigger/ ^{100 200 mA}
current/voltage are the lowest  ⁵⁰
-
value which will trigger all units  _{2.5 -}
12 V anode to cathode applied _{1.8 3.0}
V
T_J = 125 °C
1.1 -
I_GD
Maximum gate current/voltage
not to trigger is the maximum
10.0
mA
T_J = T_J maximum value which will not trigger any
V_GD
unit with rated V_DRM anode to
cathode applied
0.25
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum operating junction temperature range
T_J
Maximum storage temperature range
T_Stg
Maximum thermal resistance, junction to heatsink R_thJ-hs
DC operation single side cooled
DC operation double side cooled
Maximum thermal resistance, case to heatsink
R_thC-hs
DC operation single side cooled
DC operation double side cooled
Mounting force, ± 10 %
Approximate weight
Case style
See dimensions - link at the end of datasheet
VALUES UNITS
- 40 to 125
°C
- 40 to 150
0.09
0.04
K/W
0.02
0.01
9800
N
(1000)
(kg)
83
g
TO-200AB (E-PUK)
R_thJ-hs CONDUCTION
CONDUCTION ANGLE
SINUSOIDAL CONDUCTION
SINGLE SIDE DOUBLE SIDE
RECTANGULAR CONDUCTION
SINGLE SIDE DOUBLE SIDE
TEST CONDITIONS
UNITS
180°
0.010
0.011
0.007
0.007
120°
0.012
0.012
0.012
0.013
90°
0.015
0.015
0.016
0.017
T_J = T_J maximum
K/W
60°
0.022
0.022
0.023
0.023
30°
0.036
0.036
0.036
0.037
Note
• The table above shows the increment of thermal resistance R_thJ-hs when devices operate at different conduction angles than DC
Revision: 25-Nov-13
3
Document Number: 94403
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