VEMD6060X01 Datasheet, PDF (3/8 Pages) Vishay Siliconix – Silicon PIN Photodiode

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12
f = 1 MHz, E = 0
10
8
6
4
2
0
0.001 0.01 0.1
1
10 100
V_R - Reverse Voltage (V)
Fig. 5 - Diode Capacitance vs. Reverse Voltage
VEMD6060X01
Vishay Semiconductors
0° 10° 20°
30°
40°
1.0
0.9
50°
0.8
60°
0.7
70°
80°
0.6 0.4 0.2 0
Fig. 7 - Relative Radiant Sensitivity vs. Angular Displacement
1.0
0.8
0.6
0.4
0.2
0
400 500 600 700 800 900 1000 1100
λ - Wavelength (nm)
Fig. 6 - Relative Spectral Sensitivity vs. Wavelength
REFLOW SOLDER PROFILE
300
250 ^{255 °C}
240 °C
217 °C
200
max. 260 °C
245 °C
max. 30 s
150
max. 120 s
max. 100 s
100
max. ramp down 6 °C/s
50 _{max. ramp up 3 °C/s}
0
0
19841
50 100 150 200 250 300
Time (s)
Fig. 8 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 72 h
Conditions: T_amb < 30 °C, RH < 60 %
Moisture sensitivity level 4, according to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Rev. 1.0, 14-Jan-16
3
Document Number: 84296
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000