T163VU Datasheet, PDF (3/4 Pages) Vishay Siliconix – Infrared Emitting Diode Chip, 950 nm, GaAs

T163VU
Infrared Emitting Diode Chip, 950 nm, GaAs _{Vishay Semiconductors}
MECHANICAL DIMENSIONS
PARAMETER
SYMBOL
Length of chip edge (x-direction)
L_x
Length of chip edge (y-direction)
L_y
Emission area
A_E
Die height
H
Diameter of bondpad
d
MIN.
TYP.
0.37
0.37
0.34 x 0.34
0.265
0.14
MAX.
UNIT
mm
mm
mm²
mm
mm
ADDITIONAL INFORMATION ⁽¹⁾
Frontside metallization, anode
Aluminum
Backside metallization, cathode
Gold alloy
Dicing
Die bonding technology
Sawing
Epoxy bonding
Note
(1) _{All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870.}
The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip
backside is performed with stereo microscope with incident light and 40x to 80x magnification.
The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure
by QM is not installed.
HANDLING AND STORAGE CONDITIONS
• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only. It
is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.
• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as defined
in MIL-HDBK-263.
• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used.
PACKING
Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the wafers
are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence (humidity and
contamination).
Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take
back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for
packing material that is returned unsorted or which we are not obliged to accept.
Document Number: 81133
Rev. 1.2, 29-Mar-10
For technical questions, contact: [e-mail]
www.vishay.com
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