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JAN-03 Datasheet, PDF (3/5 Pages) Vishay Siliconix – Basic Definitions
VISHAY
Vishay Semiconductors
VRSM Surge reverse voltage (non-repetitive)
VFRM Repetitive peak forward voltage
VRRM Repetitive peak reverse voltage
VFWM Crest working forward voltage
VRWM Crest working reverse voltage
List of Symbols
A Anode
a Distance (in mm)
bpn Normalized power factor
C Capacitance, general
Ccase Case capacitance
CD Diode capacitance
Ci Junction capacitance
CL Load capacitance
CP Parallel capacitance
ER Reverse avalanche energy, non-repetitive
F Noise figure
f Frequency
fg Cut-off-frequency
g Conductance
K Kelvin, absolute temperature
IF Forward current
iF Forward current, instantaneous total value
IFAV Average forward current, rectified current
IFRM Repetitive peak forward current
IFSM Surge forward current, non-repetitive
IFWM Crest working forward current
IR Reverse current
IRM Maximum reverse current
iR Reverse current, instantaneous total value
IRAV Average reverse current
IRRM Repetitive peak reverse current
IRSM Non-repetitive peak reverse current
IRWM Crest working reverse current
IS Supply current
IZ Z-operating current
IZM Z-maximum current
l
Length (in mm), (case-holder/soldering point)
LOCEP (local epitaxy)
A registrated trade mark of TEMIC for a pro-
cess of epitaxial deposition on silicon. Applica-
tions occur in planer Z-diodes. It has an
advantage compared to the normal process,
with improved reverse current.
P Power
PR Reverse Power
Ptot Total power dissipation
PV Power dissipation, general
Pvp Pulse-power dissipation
Q Quality
Qrr Reverse recovery charge
RF Forward resistance
rf Differential forward resistance
RL Load resistor
rP Parallel resistance, damping resistance
RR Reverse resistance
rr Differential reverse resistance
rs Series resistance
RthJA Thermal resistance between junction and
ambient
RthJC Thermal resistance between junction and case
RthJL Thermal resistance junction lead
rz Differential Z-resistance in breakdown region
(range) rz = rzj + rzth
rzj Z-resistance at constant junction temperature,
inherent Z-resistance
rzth Thermal part of the Z-resistance
T Temperature, measured in centigrade
T Absolute temperature, Kelvin temperature
T Period duration
Tamb Ambient temperature (range)
tav Integration time
Tcase Case temperature
tfr Forward recovery time
Tj Junction temperature
TK Temperature coefficient
TL Connecting lead temperature in the holder (sol-
dering point) at the distance/(mm) from case
tP Pulse duration (time)
t--p- Duty cycle
T
tr Rise time
trr Reverse recovery time
ts Storage time
Tsd Soldering temperature
Tstg Storage temperature (range)
V(BR) Breakdown voltage
VF Forward voltage
VF Forward voltage, instantaneous total value
VFAV Average forward voltage
Vo Rectified voltage
VFP Turn on transient peak voltage
Document Number 84067
Rev. 7, 07-Jan-03
www.vishay.com
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