CRCW-HRE3 Datasheet, PDF (3/5 Pages) Vishay Siliconix – Suitable for voltage dividers and hybrids

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DERATING
100
%
50
D/CRCW-HR e3
Vishay
0
- 50
0
50 ₇₀
100 °C 150
Ambient Temperature in _amb
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
4.5
_
4.13
_
4.17.2
58 (Td)
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
_
21 (Uu₃)
21 (Uu₁)
14 (Na)
_
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
_
Resistance
Short time overload
Solderability
Temperature
coefficient
Shear (adhesion)
Substrate bending
Rapid change of
temperature
Climatic sequence:
Dry Heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
D.C. Load
D/CRCW-HR e3
11 M to 470 M
-
U = 2.5 x √P₇₀ x R  2 x U_max.;
Duration acc. to style
±5%
± (0.5 % R + 0.05 )
Solder bath method;
Sn60Pb40
Good tinning ( 95 % covered); no visible
damage
Solder bath method;
Sn96, 5Ag3Cu0.5 or
Sn99, 3Cu0.7
non-activated flux;
(245 ± 5) °C or (250 ± 5) °C
(3 ± 0.3) s
20 °C/- 55 °C/20 °C and
20 °C/125 °/20 °C
RR 1608: 9 N
RR 2012 and RR 3216: 45N
Depth 2 mm;
3 times
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles
1000 cycles
Good tinning ( 95 % covered); no visible
damage
± 500 ppm/K
No visible damage
No visible damage, no open circuit in bent
position
± (0.25 % R + 0.05 )
± (0.5 % R + 0.05 )
± (1 % R + 0.05 )
-
125 °C; 16 h
55 °C;  90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;  90 % RH
24 h; 5 cycle
U = √P₇₀ x R
± (2 % R + 0.1 )
Revision: 12-Jun-12
3
Document Number: 20022
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