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CRA04P08310K0JTD Datasheet, PDF (3/4 Pages) Vishay Siliconix – Thick Film Chip Resistor Array
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CRA04P
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (R) (1)
STABILITY CLASS 2 OR BETTER
Stability for product type:
10  to 1 M
CRA04P
1  to 1 M
4.5
-
Resistance
-
±2%
±5%
4.7
-
4.13
-
4.17.2 58 (Td)
Voltage proof
Short time overload
Solderability
U = 1.4 x Uins; 60 s
U = 2.5 x P70 x R
 2 × Umax.; Duration according to style
Solder bath method; Sn60Pb40;
non-activated flux; (235 ± 5) °C; (2 ± 0.2) s
Solder bath method; Sn96.5Ag3Cu0.5;
non-activated flux; (245 ± 5) °C; (3 ± 0.3) s
No flashover or breakdown
± (0.5 % R + 0.05 )
Good tinning ( 95 % covered)
no visible damage
Good tinning ( 95 % covered)
no visible damage
4.8.4.2
-
Temperature coefficient
(20/- 55/20) °C and (20/125/20) °C
± 100 ppm/K ± 200 ppm/K
4.32
4.33
21 (UU3)
21 (UU1)
Shear (adhesion)
Substrate bending
45 N
Depth 2 mm; 3 times
No visible damage
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 )
4.19
14 (Na)
Rapid change of temperature
30 min. at - 55 °C; 30 min at 125 °C
5 cycles
1000 cycles
± (0.5 % R + 0.05 )
± (1 % R + 0.05 )
4.23
-
Dry heat
-
4.23.2 2 (Ba)
Damp heat, cyclic
125 °C; 16 h
4.23.3 30 (Db)
Cold
55 °C;  90 % RH; 24 h; 1 cycle
4.23.4
1 (Aa)
Low air pressure
- 55 °C; 2 h
± (2 % R + 0.05 )
4.23.5 13 (M)
-
1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db)
Damp heat, cyclic
55 °C;  90 % RH; 24 h; 5 cycle
4.23.7
-
4.25.1
-
D.C. load
Endurance at 70 °C
U = P70 x R
U
=
1.5
h Po7n0 ;
x R
0.5 h
oUffm; ax.
70 °C; 1000 h
70 °C; 8000 h
± (2 % R + 0.1 )
± (4 % R + 0.1 )
4.18.2 58 (Td)
Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s
± (0.5 % R + 0.05 )
4.35
-
Flammability, needle flame test
IEC 60695-11-5; 10 s
No burning after 30 s
4.24
78 (Cab)
Damp heat, steady state
(40 ± 2) °C; (93 ± 3) % RH; 56 days
± (1 % R + 0.05 )
4.25.3
-
Endurance at
upper category temperature
155 °C; 1000 h
± (2 % R + 0.1 )
4.40
-
Electrostatic discharge
(human body model)
IEC 61340-3-1; 3 positive and 3 negative
discharges; ESD voltage according to style
± (1 % R + 0.05 )
4.29
45 (XA) Component solvent resistance
Isopropyl alcohol; 50 °C; method 2
No visible damage
4.30
45 (XA)
Solvent resistance of marking
Isopropyl alcohol; 50 °C; method 1;
toothbrush
Marking legible,
no visible damage
4.22
6 (Fc)
Vibration, endurance by sweeping
f = 10 Hz to 2000 Hz; x, y, z  1.5 mm;
A  200 m/s2; 10 sweeps per axis
± (0.5 % R + 0.05 )
4.37
-
Periodic electric overload
U=
0.1 s
15
on;
2x.5Ps70ofxf;
R2
1000
cxyUclmesax.
± (1 % R + 0.05 )
4.27
-
Single pulse high voltage overload,
10 μs/700 μs
Û = 10 x 10P7p0uxlseRs  2 x Umax.
± (1 % R + 0.05 )
Note
(1) Figures are given for a single element.
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2, environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Revision: 24-Jun-13
3
Document Number: 31048
For technical questions, contact: thickfilmchip@vishay.com
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