CCF60_15 Datasheet, PDF (3/4 Pages) Vishay Siliconix – Metal Film Resistors, Industrial, ± 1 % Tolerance

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DERATING CURVE
120
100
80
60
40
20
0
- 55 - 25 0
25
50 75 100 125
70
155 ¹⁷⁵
Ambient Temperature in °C
Note
• (Reference only: Not for all values specified. Consult factory for your specific value.)
CDHV
Vishay Techno
TYPE
TERMINATION
MATERIAL
TERMINATION
STYLE
TERMINATION STYLE/
MATERIAL CODE
SOLDER TERMINATION
CODE
3-sided (wraparound)
AF
Solderable
Nickel barrier
Top only (flip chip)
BF
E or T (standard);
F or S (optional) ⁽¹⁾
3-sided (wraparound)
AG
Solderable
Non-magnetic
Top only (flip chip)
BG
E or T (standard);
F or S (optional) ⁽¹⁾
Epoxy bondable/
solderable
Platinum palladium gold
Top only (flip chip)
BE
N (standard);
F or S (optional) ⁽²⁾
Wire bondable/
epoxy bondable
Gold
Top only (flip chip)
BC
N
Palladium silver ⁽³⁾
BA
Epoxy bondable
Platinum gold
Top only (flip chip)
BB
N
Platinum silver
BD
Notes
(1) _{Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are}
also available.
(2) _{Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring}
solderable mounting.
(3) _{While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.}
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues.
Revision: 21-Apr-15
3
Document Number: 68020
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000