BFC2809090 Datasheet, PDF (3/5 Pages) Vishay Siliconix – Top and bottom adjustment

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BFC2 809 090..
Vishay BCcomponents
ORDERING INFORMATION
C_min. / C_max.
(pF)
CATALOG NUMBER BFC2 809 090..
ROUND HEAD TOP AND BOTTOM ADJUSTMENT
VERSION WITH 1 ROTOR CONTACT
VERSION WITH 2 ROTOR CONTACTS
1.4 / 5.5
04
01
2/9
05
02
3 / 18
06
03
ELECTRICAL DATA
GUARANTEED
MAX. C_min. /
MIN. C_max.
AT 200 kHz
(pF)
SHAPE
OF HEAD
DIEL.
1.4 / 5.5
Round
Round
2/9
Round
Round
PTFE ⁽¹⁾
3 / 18
Round
Round
tan 
AT C_max. x 10^-4
1 MHz 100 MHz
 10
 15
Notes
(1) _{PTFE = Polytetrafluorethylene.}
(2) _{C: 60 % to 80 % of Cmax.; Tamb: from +20 °C to +125 °C.}
(3) _{Version with one rotor contact.}
(4) _{Version with two rotor contacts.}
TEMP.
COEFF. ⁽²⁾
(10^-6/K)
-250 ± 350
MIN. f_res
AT C_max.
(MHz)
COL.
OF
DOT
850
Green
580
White
360
Red
SPQ
525
525
525
525
525
525
CATALOG NUMBER
BFC2 ... .....
.... 809 09004 ⁽³⁾
.... 809 09001 ⁽⁴⁾
.... 809 09005 ⁽³⁾
.... 809 09002 ⁽⁴⁾
.... 809 09006 ⁽³⁾
.... 809 09003 ⁽⁴⁾
SOLDERING CONDITIONS
For general soldering conditions and wave soldering profile, we refer to the application note “Soldering Guidelines for Film
Capacitors”: www.vishay.com/doc?28171
TEST PROCEDURES AND REQUIREMENTS
IEC
60418-1
CLAUSE
IEC 60068
TEST
METHOD
TEST
PROCEDURE
4.2
Method of mounting
Method A
14
Capacitance drift
After TC measurement
19
Thrust
Axial thrust of 2 N
21
Robustness of terminations:
21.1
Ua
Tensile
1N
21.2
Ub
Bending
1 cycle
22
Na
Rapid change of temperature 1 cycle; 0.5 h at lower and
0.5 h at upper category
temperature
23
T
Soldering:
Ta
Solderability
Solder bath immersion 3 mm;
235 °C; 2 s
Tb
Resistance to heat
24
Eb
Impact bump
Solder bath: 260 °C; 10 s
4000 ± 10 bumps; 40 g; 6 ms
REQUIREMENTS
C/C:  2.0 %;  3.0 % for 9 pF
C/C:  0.3 %
No damage
No damage
C/C:  3 %
Good wetting,
no mechanical damage
No mechanical damage
C/C:  0.5 %;
no mechanical damage
Revision: 04-Aug-15
3
Document Number: 28532
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000