153CRV_08 Datasheet, PDF (3/9 Pages) Vishay Siliconix – Aluminum Capacitors SMD (Chip) Long Life Vertical

153 CRV
Vishay BCcomponents
Aluminum Capacitors
SMD (Chip) Long Life Vertical
Table 2
DIMENSIONS in millimeters AND MASS
NOMINAL
CASE SIZE
LxWxH
CASE
CODE
L_max.
W_max.
H_max.
4.0 x 4.0 x 5.3
0405
4.5
4.5
5.5
5.0 x 5.0 x 5.3
6.3 x 6.3 x 5.3
8.0 x 8.0 x 6.5
8.0 x 8.0 x 10
0505
0605
0807
0810
5.5
5.5
5.5
6.8
6.8
5.5
8.6
8.6
6.8
8.6
8.6 10.5
10 x 10 x 10
10 x 10 x 12
10 x 10 x 14
1010
1012
1014
10.6
10.6 10.5
10.6
10.6 12.3
10.6
10.6 14.3
ØD
B_max.
4.0
0.8
5.0
0.8
6.3
0.8
8.0
0.8
8.0
1.1
10.0
1.1
10.0
1.2
10.0
1.2
S
MASS
(g)
1.0 ≈ 0.13
1.4 ≈ 0.20
2.0 ≈ 0.30
2.3 ≈ 0.50
3.1 ≈ 1.00
4.7 ≈ 1.30
4.5 ≈ 1.40
4.5 ≈ 1.50
MOUNTING
The capacitors are designed for automatic placement on to
printed-circuit boards.
Optimum dimensions of soldering pads depend amongst
others on soldering method, mounting accuracy, print layout
and/or adjacent components.
For recommended soldering pad dimensions, refer to Fig.3
and Table 3.
L
0.4 ± 0.2
WB
S
D
W
0.3
max.
Fig.2 Dimensional outline
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
soldering pad and on top of the case during processing.
For maximum conditions refer to Fig.4.
Maximum 2 runs with pause of minimum 30 min between.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
Fig.3 Recommended soldering
pad dimensions
AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION
SHALL BE THE MINIMUM NECESSARY REQUIRED TO
ENSURE GOOD SOLDERING CONNECTIONS. HOWEVER, THE
SPECIFIED MAXIMUM CURVES SHOULD NEVER BE
EXCEEDED.
Table 3
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters
CASE CODE
a
b
c
0405
2.6
1.6
1.0
0505
3.0
1.6
1.4
0605
3.5
1.6
1.9
0807
4.0
1.6
2.1
0810
3.5
2.5
3.0
1010
4.0
2.5
4.0
1012
4.3
2.5
4.0
1014
4.3
2.5
4.0
www.vishay.com
52
For technical questions, contact: [e-mail]
Document Number: 28388
Revision: 15-Oct-08