153CLV_08 Datasheet, PDF (3/8 Pages) Vishay Siliconix – Aluminum Capacitors SMD (Chip) Long Life Vertical

Aluminum Capacitors
SMD (Chip) Long Life Vertical
153 CLV
Vishay BCcomponents
Table 2
DIMENSIONS in millimeters AND MASS
NOMINAL
CASE SIZE
LxWxH
4.0 x 4.0 x 5.3
5.0 x 5.0 x 5.3
6.3 x 6.3 x 5.3
8.0 x 8.0 x 6.5
8.0 x 8.0 x 10
10 x 10 x 10
10 x 10 x 12
10 x 10 x 14
CASE
CODE
0405
0505
0605
0807
0810
1010
1012
1014
L_max.
4.5
5.5
6.8
8.6
8.6
10.6
10.6
10.6
W_max.
H_max.
ØD
B_max.
S
4.5
5.5
4.0
0.8
1.0
5.5
5.5
5.0
0.8
1.4
6.8
5.5
6.3
0.8
2.0
8.6
6.8
8.0
0.8
2.3
8.6
10.5
8.0
1.1
3.1
10.6
10.5
10.0
1.1
4.7
10.6
12.3
10.0
1.2
4.5
10.6
14.3
10.0
1.2
4.5
0.4 ± 0.2
L
C
2.0 ± 0.2
2.3 ± 0.2
2.7 ± 0.2
3.4 ± 0.2
3.0 ± 0.2
3.3 ± 0.2
3.9 ± 0.2
3.9 ± 0.2
MASS
(g)
≈ 0.13
≈ 0.20
≈ 0.30
≈ 0.50
≈ 1.00
≈ 1.30
≈ 1.40
≈ 1.50
WB
CSC
0.3 max.
Fig. 2 Dimensional outline
MOUNTING
The capacitors are designed for automatic placement on to
printed-circuit boards.
Optimum dimensions of soldering pads depend amongst
others on soldering method, mounting accuracy, print layout
and/or adjacent components.
For recommended soldering pad dimensions, refer to Fig.3
and Table 3.
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
soldering pad during processing.
For maximum conditions refer to Fig.4.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
Fig.3 Recommended solder pad dimensions
AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION
SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE
GOOD SOLDERING CONNECTIONS. HOWEVER, THE
SPECIFIED MAXIMUM CURVES SHOULD NEVER BE
EXCEEDED.
Table 3
RECOMMENDED SOLDERING PAD
DIMENSIONS in millimeters
CASE CODE
a
b
c
0405
2.6
1.6
1.0
0505
3.0
1.6
1.4
0605
3.5
1.6
1.9
0807
4.0
1.6
2.1
0810
3.5
2.5
3.0
1010
4.0
2.5
4.0
1012
4.3
2.5
4.0
1014
4.3
2.5
4.0
T_PAD ²⁸⁰
(°C)260
240
220
200
180
160
140
120
100
80
0
50
100
150
200 _{t (s)} 250
Fig.4 Maximum temperature load during infrared reflow
soldering measured on the soldering pad
Document Number: 28302
Revision: 16-May-08
For technical questions, contact: [e-mail]
www.vishay.com
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