139CLL_13 Datasheet, PDF (3/8 Pages) Vishay Siliconix – Aluminum Capacitors SMD (Chip) Long Life

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Not for New Design
139 CLL
Vishay BCcomponents
Table 2
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters (placement accuracy ± 0.25 mm)
NOMINAL CASE SIZE
LxWxH
FOR REFLOW SOLDERING
FOR WAVE SOLDERING
A
B
C
D
E
F
G
A
B
C
D
E
F
G
14.3 x 6.2 x 6.9
15.8 8.8 3.5 2.8 8.0 16.2 7.7 18.6 10.0 4.3 5.0 8.8 20.5 11.5
14.3 x 7.6 x 8.2
15.8 8.8 3.5 2.8 8.0 16.2 9.1 18.6 10.0 4.3 6.0 8.8 21.5 13.0
MOUNTING
The capacitors are designed for automatic placement on to printed-circuit boards or hybrid circuits.
Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print lay-out and/or
adjacent components.
For recommended soldering pad dimensions, refer to Fig. 3 and Table 2.
E
E
DG
DG
C
B
A
F
Reflow soldering
C
B
A
F
Wave soldering
Solder land/
solder paste
pattern
Solder resist
pattern
Occupied
area
Tracks or
dummy tracks
Fig. 3 - Recommended pad dimensions for reflow and wave soldering
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
soldering pad during processing.
For maximum conditions of different soldering methods see
Fig. 4, 5 and 6.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
AS A GENERAL PRINCIPLE, TEMPERATURE AND
DURATION SHALL BE THE MINIMUM NECESSARY
REQUIRED TO ENSURE GOOD SOLDERING
CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM
CURVES SHOULD NEVER BE EXCEEDED.
Table 3
CURING CONDITIONS FOR SMD-GLUE
MAX. T_amb
(°C)
MAX. EXPOSURE TIME
(min)
125
30
140
10
150
5
160
2
160
2
Revision: 11-Feb-13
3
Document Number: 28301
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