595D687X0010R2T Datasheet, PDF (23/24 Pages) Vishay Siliconix – Solid Tantalum Chip Capacitors TANTAMOUNT, Conformal Coated, Maximum CV

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GUIDE TO APPLICATION
1. AC Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
I_RMS =
-----^P-------
R_ESR
where,
P = Power dissipation in W at + 25 °C as given in
the tables in the product datasheets (Power
Dissipation).
R_ESR = The capacitor equivalent series resistance at
the specified frequency
2. AC Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
V_RMS = I_RMS x Z
or, from the formula:
V_RMS = Z
-----^P-------
R_ESR
where,
P = Power dissipation in W at + 25 °C as given in
the tables in the product datasheets (Power
Dissipation).
R_ESR = The capacitor equivalent series resistance at
the specified frequency
Z = The capacitor impedance at the specified
frequency
2.1 The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+ 25 °C.
3. Reverse Voltage: Solid tantalum capacitors are not
intended for use with reverse voltage applied.
However, they have been shown to be capable of
withstanding momentary reverse voltage peaks of up
to 10 % of the DC rating at 25 °C and 5 % of the DC
rating at + 85 °C.
4. Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible RMS ripple current or voltage shall be
calculated using the derating factors as shown:
TEMPERATURE
+ 25 °C
+ 85 °C
+ 125 °C
DERATING FACTOR
1.0
0.9
0.4
Conformal Coated Guide
Vishay Sprague
5. Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent I_RMS value
be established when calculating permissible
operating levels. (Power dissipation calculated using
derating factor (see paragraph 4)).
6. Attachment:
6.1 Soldering: Capacitors can be attached by
conventional soldering techniques, convection,
infrared reflow, wave soldering and hot plate
methods. The soldering profile chart shows typical
recommended time/temperature conditions for
soldering. Preheating is recommended to reduce
thermal stress. The recommended maximum preheat
rate is 2 °C/s. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
7. Recommended Mounting Pad Geometries: The
nib must have sufficient clearance to avoid electrical
contact with other components. The width
dimension indicated is the same as the maximum
width of the capacitor. This is to minimize lateral
movement.
8. Cleaning (Flux Removal) After Soldering:
TANTAMOUNT^® capacitors are compatible with all
commonly used solvents such as TES, TMS, Prelete,
Chlorethane, Terpene and aqueous cleaning media.
However, CFC/ODS products are not used in the
production of these devices and are not
recommended. Solvents containing methylene
chloride or other epoxy solvents should be avoided
since these will attack the epoxy encapsulation
material.
Revision: 23-Jul-13
11
Document Number: 40150
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