VSKCS201_10 Datasheet, PDF (2/7 Pages) Vishay Siliconix – ADD-A-PAK Generation VII Power Modules Schottky Rectifier, 200 A

VSKCS201/045
Vishay Semiconductors
ADD-A-PAK Generation VII
Power Modules Schottky Rectifier, 200 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average
forward current
per module
per leg
I_F(AV)
Maximum peak one cycle
non-repetitive surge current
I_FSM
Non-repetitive avalanche energy
E_AS
Repetitive avalanche current
I_AR
TEST CONDITIONS
50 % duty cycle at T_C = 123 °C, rectangular waveform
5 μs sine or 3 μs rect. pulse
10 ms sine or 6 ms rect. pulse
Following any rated
load condition and with
rated V_RRM applied
T_J = 25 °C, I_AS = 24 A, L = 1 mH
Current decaying linearly to zero in 1 μs
Frequency limited by T_J maximum V_A = 1.5 x V_R typical
VALUES
200
100
8600
1850
270
20
UNITS
A
mJ
A
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum forward voltage drop
V_FM
Maximum reverse leakage current
Maximum junction capacitance
Typical series inductance
Maximum voltage rate of change
I_RM
C_T
L_S
dV/dt
TEST CONDITIONS
100 A
200 A
T_J = 25 °C
100 A
200 A
T_J = 125 °C
T_J = 25 °C
T_J = 125 °C
V_R = Rated V_R
V_R = 5 V_DC (test signal range 100 kHz to 1 MHz), 25 °C
Measured lead to lead 5 mm from package body
Rated V_R
Maximum RMS insulation voltage
V_INS
50 Hz
VALUES UNITS
0.72
1.04
V
0.69
0.98
10
mA
90
5200
pF
7.0
nH
10 000
V/μs
3000 (1 min)
V
3600 (1 s)
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES UNITS
Maximum junction and storage
temperature range
Maximum thermal resistance,
junction to case per leg
Typical thermal resistance,
case to heatsink per module
T_J, T_Stg
R_thJC
DC operation
R_thCS
- 55 to 175 °C
0.52
°C/W
0.1
Approximate weight
75
g
2.7
oz.
Mounting torque ± 10 %
to heatsink
busbar
A mounting compound is recommended and the torque
4
should be rechecked after a period of 3 hours to allow for
Nm
the spread of the compound.
3
Case style
JEDEC
TO-240AA compatible
www.vishay.com
2
For technical questions within your region, please contact one of the following: Document Number: 93233
[e-mail], [e-mail], [e-mail]
Revision: 18-May-10