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VS-50PF Datasheet, PDF (2/9 Pages) Vishay Siliconix – Wire version available
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VS-50PF(R)...(W) Series
Vishay Semiconductors
FORWARD CONDUCTION
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum average forward current 
at case temperature
IF(AV)
180° conduction, half sine wave
Maximum RMS forward current
IF(RMS)
Maximum peak, one-cycle forward,
non-repetitive surge current
IFSM
Maximum I2t for fusing
I2t
Maximum I2t for fusing
Low level value of threshold voltage
Low level value of forward
slope resistance
Maximum forward voltage drop
I2t
VF(TO)
rf
VFM
t = 10 ms
t = 8.3 ms
No voltage 
reapplied
t = 10 ms
t = 8.3 ms
t = 10 ms
t = 8.3 ms
100 % VRRM
reapplied
No voltage 
reapplied
Sinusoidal half wave,
initial TJ = 150 °C
t = 10 ms
t = 8.3 ms
100 % VRRM
reapplied
t = 0.1 ms to 10 ms, no voltage reapplied
(16.7 % x  x IF(AV) < I <  x IF(AV)), TJ = TJ maximum
(16.7 % x  x IF(AV) < I <  x IF(AV)), TJ = TJ maximum
Ipk = 125 A, TJ = 25 °C, tp = 400 μs rectangular wave
VALUES
50
140
78
800
830
670
700
3200
2900
2260
2050
32 000
0.77
4.30
1.40
UNITS
A
°C
A
A
A2s
A2s
V
m
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum junction operating and
storage temperature range
TJ, TStg
Maximum thermal resistance,
junction to case
RthJC
DC operation
Maximum thermal resistance,
case to heatsink
RthCS Mounting surface, smooth, flat and greased
Allowable mounting torque
Tighting on nut (1)
Not lubricated threads
Tighting on Hexagon (2)
Lubricated threads
Approximate weight
Case style
See dimensions - link at the end of datasheet
Notes
(1) As general recommendation we suggest to tight on Hexagon and not on nut
(2) Torque must be applicable only to Hexagon and not to plastic structure
VALUES
-55 to +180
UNITS
°C
0.51
K/W
0.25
3.4 + 0 - 10 %
(30)
2.3 + 0 - 10 %
(20)
N·m
(lbf · in)
15.8
g
0.56
oz.
DO-203AB (DO-5)
RthJC CONDUCTION
CONDUCTION ANGLE SINUSOIDAL CONDUCTION
RECTANGULAR CONDUCTION
TEST CONDITIONS
UNITS
180°
0.11
0.10
120°
0.16
0.16
90°
0.20
60°
0.29
0.22
TJ = TJ maximum
K/W
0.31
30°
0.49
0.50
Note
• The table above shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC
Revision: 04-Dec-14
2
Document Number: 93516
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