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SI4932DY Datasheet, PDF (2/7 Pages) Vishay Siliconix – Dual N-Channel 30-V (D-S) MOSFET
Si4932DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate Threshold Voltage
Gate Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currentb
Drain-Source On-State Resistanceb
Forward Transconductanceb
Dynamica
VDS
ΔVDS/TJ
ΔVGS(th)/TJ
VGS(th)
IGSS
IDSS
ID(on)
RDS(on)
gfs
VGS = 0 V, ID = 250 µA
ID = 250 µA
VDS = VGS , ID = 250 µA
VDS = 0 V, VGS = ± 20 V
VDS = 30 V, VGS = 0 V
VDS = 30 V, VGS = 0 V, TJ = 55 °C
VDS = 5 V, VGS = 10 V
VGS = 10 V, ID = 7 A
VGS = 4.5 V, ID = 5 A
VDS = 15 V, ID = 7 A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Ciss
Coss
Crss
Qg
N-Channel
VDS = 15 V, VGS = 0 V, f = 1 MHz
VDS = 15 V, VGS = 10 V, ID = 5 A
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Qgs
Qgd
Rg
td(on)
tr
td(off)
tf
td(on)
tr
td(off)
tf
N-Channel
VDS = 15 V, VGS = 4.5 V, ID = 5 A
f = 1 MHz
N-Channel
VDD = 15 V, RL = 3 Ω
ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω
N-Channel
VDD = 15 V, RL = 3 Ω
ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Currenta
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
TC = 25 °C
IS = 2 A
N-Channel
IF = 5 A, dI/dt = 100 A/µs, TJ = 25 °C
Min.
30
1.2
20
0.2
Typ. Max. Unit
34
-6
0.0122
0.0138
40
2.5
100
1
10
0.015
0.017
V
mV/°C
V
nA
µA
A
Ω
S
1750
265
pF
115
32
48
14.7
22
nC
5.1
3.7
1.0
2.0
Ω
21
40
10
20
26
50
8
16
ns
9
18
8
16
24
45
8
16
2.6
A
30
0.75
1.2
V
23
45
ns
16
32
nC
13
ns
10
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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2
Document Number: 69012
S-83042-Rev. A, 22-Dec-08