SI4788CY Datasheet, PDF (2/7 Pages) Vishay Siliconix – 5-A Controlled Slew Rate Load Switch with Level Shift

Si4788CY
Vishay Siliconix
New Product
ABSOLUTE MAXIMUM RATINGS
Voltage Referenced to GND
V_S, V_Da . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 7.0 V
V_IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 7.0 V
Power Dissipation (Continuous)^a . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W
Continuous P-Switch Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 A
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55 to 150_C
Notes
a. Device mounted with all leads soldered to 1” x 1” FR4 with laminated
copper PC board.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING RANGE
V_S, V_D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8 V to 5.5 V
V_IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5.5 V
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . –25 to 85_C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –25 to 150_C
This device has a maximum recommended operating junction temperature of 85_C. This temperature limit is used for electrical specifications such as logic transition
voltages only and is not a reliability limit. The device can be used with junction temperatures up to 150_C if relaxed specifications can be tolerated, although limits for
these specifications may not be given. Performance curves can be used to give an indication of specifications at higher temperatures, but are not guaranteed.
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{NO TAG}
Maximum Junction-to-Foot (Drain)^{NO TAG}
Steady State
R_thJA
80
Steady State
R_thJF
15
95
_C/W
20
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Junction-to-foot thermal impedance represents the effective thermal impedance of all heat carrying leads in parallel and is intended for use in conjunction with
the thermal impedance of the PC board pads to ambient (R_thJA = R_thJF + Rt_hPCB-A). It can also be used to estimate chip temperature if power dissipation and
the lead temperature of a heat carrying (drain) lead is known.
SPECIFICATIONS
Parameter
Symbol
Specific Test Conditions
Temp^a
Limits
Min^b Typ^c
Max^b
Unit
On-Resistance
Pull-Down Resistance
Leakage Current
Logic Input Voltage Low
Input Voltage High
Turn-On Delay
Turn-Off Delay
Rise Time
Fall Time
Maximum Turn-On Slew Rate
r_DS(on)
r_PULL-DOWN
I_S(off)
V_INL
V_INH
t_d(on)
t_d(off)
t_RISE
t_FALL
dv/dt
V_S = 3.3 V, I_D = 1 A, V_IN = H
V_S = 4.5 V, I_D = 1 A, V_IN = H
V_S = 3.3 V to 5 V, V_IN = L
V_S = 1.8 V to 5 V, V_IN = L
V_S = 3.3 V to 5 V
V_S = 1.8 V to 3.3 V
V_S = 3.3 V to 5 V
V_S = 1.8 V to 3.3 V
V_IN = 5 V, I_LOAD = 1 A, C_LOAD = 100 mF
Test Circuit 1
Room
Room
Room
8
Room
Full
Full
Full
2.2
Full
1.5
Room
Room
Room
Room
Room
Notes
a. Room = 25_C, Full = as determined by the operating temperature suffix.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
www.vishay.com
2-2
20
25
mW
16
20
12
20
W
1.2
mA
0.6
0.3
V
16
35
20
40
ms
280
550
920
1800
20
V/ms
Document Number: 71100
S-02651—Rev. C, 27-Nov-00