SD200R20PC Datasheet, PDF (2/7 Pages) Vishay Siliconix – Standard Recovery Diodes (Stud Version), 200 A

SD200N/R Series
Vishay High Power Products ^{Standard Recovery Diodes}
(Stud Version), 200 A
FORWARD CONDUCTION
PARAMETER
SYMBOL
Maximum average forward current
at case temperature
Maximum average forward current
at case temperature
I_F(AV)
Maximum RMS forward current
I_F(RMS)
Maximum peak, one-cycle forward,
non-repetitive surge current
I_FSM
Maximum I²t for fusing
I²t
Maximum I²âˆšt for fusing
Low level value of threshold voltage
High level value of threshold voltage
Low level value of forward
slope resistance
High level value of forward
slope resistance
Maximum forward voltage drop
I²âˆšt
V_F(TO)1
V_F(TO)2
r_f1
r_f2
V_FM
TEST CONDITIONS
180° conduction, half sine wave
DC at 95 °C case temperature
t = 10 ms _{No voltage}
t = 8.3 ms ^reapplied
t = 10 ms
t = 8.3 ms
t = 10 ms
t = 8.3 ms
100 % V_RRM
reapplied
No voltage
reapplied
Sinusoidal half wave,
initial T_J = T_J maximum
t = 10 ms _{100 % VRRM}
t = 8.3 ms ^reapplied
t = 0.1 to 10 ms, no voltage reapplied
(16.7 % x π x I_F(AV) < I < π x I_F(AV)),
T_J = T_J maximum
(I > π x I_F(AV)), T_J = T_J maximum
(16.7 % x π x I_F(AV) < I < π x I_F(AV)),
T_J = T_J maximum
(I > π x I_F(AV)), T_J = T_J maximum
I_pk = 630 A, T_J = T_J maximum,
t_p = 10 ms sinusoidal wave
VALUES
200
110
220
100
314
4700
4920
3950
4140
110
101
78
71
1100
0.90
1.00
0.79
0.64
1.40
UNITS
A
°C
A
°C
A
kA²s
kA²âˆšs
V
mΩ
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum junction operating
temperature range
Maximum storage temperature range
Maximum thermal resistance,
junction to case
Maximum thermal resistance,
case to heatsink
Maximum allowed
mounting torque ± 10 %
Approximate weight
Case style
T_J
T_Stg
R_thJC
R_thCS
DC operation
Mounting surface, smooth, flat and greased
Not-lubricated threads
See dimensions (link at the end of datasheet)
SD200N/R
1600 to 2000
2400
UNITS
- 40 to 180 - 40 to 150
°C
- 55 to 200
0.23
K/W
0.08
14
Nm
120
g
DO-205AC (DO-30)
www.vishay.com
2
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Document Number: 93541
Revision: 17-Apr-08