PHP_15 Datasheet, PDF (2/5 Pages) Vishay Siliconix – High Power Thin Film Wraparound Chip Resistor

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Vishay Dale Thin Film
DIMENSIONS in inches
D
CASE SIZE
0603
0805
1206
2512
LENGTH
0.064 ± 0.006
0.080 ± 0.006
0.126 ± 0.008
0.259 + 0.009/- 0.015
T
L
WIDTH
W (± 0.005)
0.032
0.050
0.063
0.124
W
E
THICKNESS
MIN./MAX.
0.020 max.
0.015/0.033
0.015/0.033
0.015/0.033
TOP PAD
D (± 0.005)
0.012
0.016
0.020 + 0.005/- 0.010
0.02
BOTTOM PAD
E (± 0.005)
0.021
0.025
0.040
0.050
LAND PATTERN DIMENSIONS in inches
0603 Land Pattern
0.0920
0.0340
0.0140
0.0390
0805 Land Pattern
0.1050
1206 Land Pattern
0.1730
0.0710
0.0755
0.0220
2512 Land Pattern
0.2910
0.0520
0.0200
0.0425
0.1260
0.0910
0.1090
STANDARD MATERIAL SPECIFICATIONS
Resistive Element
Nichrome
Substrate Material
Terminations (Tin/Lead)
Alumina (Al₂O₃)
Tin/lead solder over nickel barrier
Terminations (Lead (Pb)-free)
Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier
Revision: 07-Aug-14
2
Document Number: 60076
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000