PHP Datasheet, PDF (2/4 Pages) Vishay Siliconix – High Power Thin Film Wraparound Chip Resistor

PHP
Vishay Thin Film
High Power Thin Film Wraparound Chip Resistor
DIMENSIONS in inches
D
CASE SIZE
1206
2512
LENGTH
0.126 ± 0.008
0.259 + 0.009/- 0.015
T
L
WIDTH
W (± 0.005)
0.063
0.124
W
E
THICKNESS
MIN./MAX.
0.015/0.033
0.015/0.033
TOP PAD
D (± 0.005)
0.020 + 0.005/- 0.010
0.02
BOTTOM PAD
E (± 0.005)
0.040
0.050
LAND PATTERN DIMENSIONS in inches
PHP Land Pattern for 1206 Case Size
0.0710
0.0755
0.0220
PHP Land Pattern for 2512 Case Size
0.1260
0.0910
0.1090
STANDARD MATERIAL SPECIFICATIONS
Resistive Element
Nichrome
Substrate Material
Terminations (Tin/Lead)
Alumina (Al₂O₃)
Tin/lead solder over nickel barrier
Terminations (Lead (Pb)-free)
Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier
PHP CHIP TEMP. VS. APPLIED POWER
5.00
4.50
1206 - 100 Ω
4.00
1206 - 5 kΩ
1206 - 10 kΩ
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
70
150
200
Chip Surface Temperature (°C)
Notes
• Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 85 °C.
• Thermal imaging was conducted under ambient conditions
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels.
• Thermal imaging and load life testing was conducted mounting
one device to 2" x 3" test cards with 2.5 mil copper plating on
both surfaces. Thermal vias on 120 mil centers were utilized for
heat transfer between surfaces of the test card.
PHP CHIP TEMP. VS. APPLIED POWER
10.00
9.00
8.00
7.00
6.00
5.00
4.00
3.00
2.00
1.00
0.00
2512 - 10 Ω
2512 - 10 kΩ
2512 - 30 kΩ
70
150
200
Chip Surface Temperature (°C)
Notes
• Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 85 °C.
Case Size
Resistance
Value
Temperature
70
150
200
2512
Up to 10 
2.44
6.82
9.33
2512
Up to 10 k
Power (W)
1.81
4.89
6.63
2512
Up to 30 k
1.87
5.19
7.09
www.vishay.com
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For technical questions, contact: [e-mail]
Document Number: 60076
Revision: 24-Feb-11